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Rulon Bearings

Fire-refined Tough Pitch Copper, UNS C12500, OSO25 Temper flat products
Categories: Metal; Nonferrous Metal; Copper Alloy

Material Notes: Good to excellent corrosion resistance. Excellent hot and cold workability; good forgeability. Fabricated by coining, coppersmithing, drawing and upsetting, hot forging and pressing, spinning, swaging, stamping.

Applications: busbars, bus conductors, waveguides, hollow conductors, lead-in wires and anodes for vacuum tubes, vacuum seals, transistor components, glass to metal seals, coaxial cables and tubes, klystrons, microwave tubes, and rectifiers.

Test specimens: flat products - 1mm thickness.

UNS C12500, C12700, C12800, C12900, and C13000 are similar alloys having very similar mechanical properties; they are distinguished by differences in silver content.

Key Words: Fire-Refined Copper, FRTP. MIL-W-3318
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Physical PropertiesMetricEnglishComments
Density 8.89 g/cc0.321 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell F 4545
Tensile Strength, Ultimate 235 MPa34100 psi
Tensile Strength, Yield 76.0 MPa
@Strain 0.5 %
11000 psi
@Strain 0.5 %
Elongation at Break 45 %45 %In 50 mm
Modulus of Elasticity 115 GPa16700 ksiEstimated from similar Cu Alloys
Poissons Ratio 0.310.31Calculated
Machinability 20 %20 %UNS C36000 (free-cutting brass) = 100%
Forgeability 65 %65 %
Shear Modulus 44.0 GPa6380 ksiEstimated from similar Cu Alloys
Shear Strength 160 MPa23200 psi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity 0.00000176 ohm-cm
@Temperature 20.0 °C
0.00000176 ohm-cm
@Temperature 68.0 °F
 
Thermal PropertiesMetricEnglishComments
CTE, linear  16.8 µm/m-°C
@Temperature 20.0 - 100 °C
9.33 µin/in-°F
@Temperature 68.0 - 212 °F
 17.4 µm/m-°C
@Temperature 20.0 - 200 °C
9.67 µin/in-°F
@Temperature 68.0 - 392 °F
 17.7 µm/m-°C
@Temperature 20.0 - 300 °C
9.83 µin/in-°F
@Temperature 68.0 - 572 °F
Specific Heat Capacity 0.385 J/g-°C0.0920 BTU/lb-°F
Thermal Conductivity 377 W/m-K
@Temperature 20.0 °C
2620 BTU-in/hr-ft²-°F
@Temperature 68.0 °F
Melting Point <= 1085 °C<= 1985 °F
Solidus 1065 °C1949 °F
Liquidus 1085 °C1985 °F
Annealing Point 399 - 649 °C750 - 1200 °F
 
Processing PropertiesMetricEnglishComments
Annealing Temperature 400 - 650 °C752 - 1200 °F
Hot-Working Temperature 750 - 950 °C1380 - 1740 °F
 
Component Elements PropertiesMetricEnglishComments
Antimony, Sb <= 0.0030 %<= 0.0030 %
Arsenic, As <= 0.012 %<= 0.012 %
Bismuth, Bi <= 0.0030 %<= 0.0030 %
Copper, Cu >= 99.88 %>= 99.88 %Includes Ag
Lead, Pb <= 0.0040 %<= 0.0040 %
Nickel, Ni <= 0.050 %<= 0.050 %
Selenium, Se <= 0.025 %<= 0.025 %includes Te

References for this datasheet.

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MC12500b1 / 10592

Master Bond adhesives

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