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Chemically Resistant adhesives

Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Material Description: Silver-filled, electrically conductive, flexible epoxy

Information Provided by Epoxy Technology

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Physical PropertiesMetricEnglishComments
Specific Gravity 3.71 g/cc3.71 g/ccPart A
 4.09 g/cc4.09 g/ccPart B
Particle Size <= 45 µm<= 45 µm
Viscosity 24000 - 46000 cP
@Temperature 23.0 °C
24000 - 46000 cP
@Temperature 73.4 °F
5 rpm
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 18 ppm18 ppm
Ionic Impurities - K (Potassium) 2.0 ppm2.0 ppm
Ionic Impurities - Cl (Chloride) 295 ppm295 ppm
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7272
Tensile Modulus 3.40 GPa494 ksiStorage
Shear Strength 9.046 MPa1312 psiLap
 >= 11.7 MPa>= 1700 psiDie
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity <= 0.00050 ohm-cm<= 0.00050 ohm-cm
 
Thermal PropertiesMetricEnglishComments
CTE, linear 37.0 µm/m-°C20.6 µin/in-°FBelow Tg
 219 µm/m-°C122 µin/in-°FAbove Tg
Thermal Conductivity 1.84 W/m-K12.8 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 225 °C437 °FContinuous
 325 °C617 °FIntermittent
Minimum Service Temperature, Air -55.0 °C-67.0 °FContinuous
 -55.0 °C-67.0 °FIntermittent
Glass Transition Temp, Tg >= 50.0 °C>= 122 °FDynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 402 °C756 °FDegradation Temperature
 
Processing PropertiesMetricEnglishComments
Cure Time 15.0 min
@Temperature 120 °C
0.250 hour
@Temperature 248 °F
minimum
Pot Life 240 min240 min
Shelf Life 12.0 Month
@Temperature 25.0 °C
12.0 Month
@Temperature 77.0 °F
 
Descriptive Properties
ColorSilverPart A
 SilverPart B
ConsistencySmooth thixotropic paste
Ionic Impurities NH429 ppm
Mix Ratio by Weight4:1
Number of ComponentsTwo
Thixotropic Index5.3
Weight Loss0.06%200°C
 0.1%250°C
 0.22%300°C

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PPOXYT025 / 141064

Chemically Resistant adhesives

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