Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging. Advantages & Application Notes: - High viscosity paste. Users should not expect the same creamy viscosity as silver-filled epoxies.
- Design engineers need to be aware of longer lead times and shorter shelf-life than traditional silver-filled epoxies.
- Suggested applications for hybrid/hermetic packaging: Die-attach and SMD attach instead of silver epoxy; avoiding silver migration inside sealed packages; medical and aerospace electronics and circuits.
- Passes NASA low outgassing standard ASTM E595 with proper cure
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