Product Description: EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is the conductive adhesive of choice for non-military low chloride applications. Advantages & Application Notes: - Especially recommended for use in high speed epoxy chip bonding systems where very fast cures are desired.
- Suggested for JEDEC Level III and II for plastic IC packaging.
- Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C.
- Ease of use; apply by dispensing, screen printing, die-stamping, or by hand.
- Especially suited for high power devices and high current flow. High power LEDs.
- Opto-electronic packaging material: LED, LCDs, and fiber optic components.
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