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Metal adhesives

Hexcel® Redux® 208/5-NA Foaming adhesive film
Categories: Polymer; Adhesive; Film

Material Notes: The Redux 200 series is a range fo foaming adhesive films presented in sheet form. They expand during the cure cycle to fill gaps and adhere strongly to all parts of the structure with which they come into contact. Redux foaming adhesive films are compative with Redux film adhesives.

Features: High strength at temperatures from -67°F to 428°F; Less than 1% volatiles emitted during cure; Suitable for aluminum and fiber-reinforced composite sandwich constructions; Expansion ratios from 1:1.9 to 1:4.0.
Application: Higher foaming ratio. Suitable for applications not requiring vacuum.
Associated Film Adhesives: Redux 308, 308A-NA

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Mechanical PropertiesMetricEnglishComments
Shear Strength  4.50 MPa
@Temperature 120 °C
652 psi
@Temperature 248 °F
Aluminum Double Lap Shear (0.06 inch gap)
 10.0 MPa
@Temperature 22.2 °C
1450 psi
@Temperature 72.0 °F
Aluminum Double Lap Shear (0.06 inch gap)
 
Processing PropertiesMetricEnglishComments
Cure Time 60.0 min
@Temperature 177 °C
1.00 hour
@Temperature 350 °F
Heat up rate 10°F/min
Shelf Life 18.0 Month
@Temperature -17.8 °C
18.0 Month
@Temperature 0.000 °F

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PHEXC429 / 99248

Metal adhesives

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