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Henkel Loctite® 5145 Form-In-Place Adhesive/Sealant
Categories: Polymer; Adhesive; Thermoset

Material Notes:
Gasketing and Wire Tackers
Loctite® innovative gasketing products offer precise, reliable sealing of electronic enclosures, protecting them from environmental hazards. Loctite offers both Form-in-place (FIP) and Cure-in-Place (CIP) compression gasket materials.

Loctite® Tak Pak Adhesives are used to secure wires to printed circuit board assemblies. The fast cure times of these adhesives help increase the throughput of the wire tacking assembly process.

Loctite® 5145 Form-In-Place Adhesive/Sealant
A high strength, non-corrosive form-in-place silicone adhesive for bonding and sealing electrical devices. This translucent, RTV cure paste complies to Mil-A-46146B, Group II, Type I. Cure Type: Moisture Bonding Type: Silicone Mil A 46146B Group II, Type I

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Mechanical PropertiesMetricEnglishComments
Hardness, Shore A 3333
Tensile Strength, Ultimate 6.89 MPa1000 psi
Elongation at Break 750 %750 %
 
Processing PropertiesMetricEnglishComments
Cure Time 1440 min
@Temperature 25.0 °C
24.0 hour
@Temperature 77.0 °F
Full Cure
 
Descriptive Properties
ColorClear/yellow
Extrusion Rate200 g/min1/8" orifice at 90 psi

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PLOCT189 / 51925

Specialty Compounds RTP Company

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