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Rulon Bearings

Hexcel® HexPly® 954-2A Curing Cyanate Resin
Categories: Polymer; Thermoset; Epoxy
Material Notes: HexPly® 954-2A is a 350°F (177°C) curing toughened cyanate resin with low moisture absorption, and excellent microcracking resistance. HexPly® 954-2A is formulated for autoclave or press molding. Recommended curing is two hours at 350°F (177°C). The recommended lay-up procedure is HSP-L3. The recommended cure procedure is HSP-C1 or HSP-C3.
Typical applications for HexPly® 954-2A include primary and secondary aircraft structure, space structures, cryogenic tanks, or any application where impact resistance, light weight and excellent dielectric properties are required. HexPly® 954-2A can be impregnated via hot melt or solution techniques on all available fibers and fabrics.

Information provided by HexCel
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Physical PropertiesMetricEnglishComments
Density 1.24 g/cc0.0448 lb/in³
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 69.0 MPa
@Temperature 23.0 °C		10000 psi
@Temperature 73.4 °F
Elongation at Break 2.59 %2.59 %
Tensile Modulus 3.00 GPa
@Temperature 23.0 °C		435 ksi
@Temperature 73.4 °F
Flexural Yield Strength  82.0 MPa
@Temperature 163 °C		11900 psi
@Temperature 325 °F		Wet (Immersion at 170°F for 7 days)
 87.0 MPa
@Temperature 177 °C		12600 psi
@Temperature 351 °F
 93.0 MPa
@Temperature 163 °C		13500 psi
@Temperature 325 °F
 117 MPa
@Temperature 23.0 °C		17000 psi
@Temperature 73.4 °F
Flexural Modulus  2.30 GPa
@Temperature 163 °C		334 ksi
@Temperature 325 °F		Wet (Immersion at 170°F for 7 days)
 2.40 GPa
@Temperature 163 °C		348 ksi
@Temperature 325 °F
 2.40 GPa
@Temperature 177 °C		348 ksi
@Temperature 351 °F
 3.00 GPa
@Temperature 23.0 °C		435 ksi
@Temperature 73.4 °F
Poissons Ratio 0.380.38
Shear Modulus 1.09 GPa158 ksiCalculated
 
Electrical PropertiesMetricEnglishComments
Dielectric Constant 2.922.92
 2.922.92
 3.13
@Frequency 1e+10 Hz		3.13
@Frequency 1e+10 Hz		Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
 3.29
@Frequency 1e+10 Hz,
Temperature 163 °C		3.29
@Frequency 1e+10 Hz,
Temperature 325 °F		Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520
Dielectric Loss Index  0.0080
@Temperature 23.0 °C		0.0080
@Temperature 73.4 °F
 0.010
@Temperature 163 °C		0.010
@Temperature 325 °F
 0.010
@Frequency 1e+10 Hz		0.010
@Frequency 1e+10 Hz		Moisture Conditioned: 71°C and 95% RH for 140 days; Room Temperature; ASTM D2520
 0.020
@Frequency 1e+10 Hz,
Temperature 163 °C		0.020
@Frequency 1e+10 Hz,
Temperature 325 °F		Moisture Conditioned: 71°C and 95% RH for 140 days; ASTM D2520
 
Thermal PropertiesMetricEnglishComments
CTE, linear 50.8 µm/m-°C28.2 µin/in-°F
Glass Transition Temp, Tg 191 °C376 °F

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PHEXC017 / 98487

Master Bond adhesives




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