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Metal adhesives

Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP1112, which utilizes a higher molecular weight aromatic diluent to significantly reduce the tendency for crystallization in the epoxy resin. It cures completely at room temperature to a tough, flexible polymer. Its low viscosity allows for good wicking and penetration into components and circuitry and also gives good air release. It has very good resistance to water, acids and bases and most organic solvents. Thermal shock and cycling properties are also enhanced by its high elongation giving it the ability to absorb difference in CTE's of substrates. It was especially formulated to a 1A:1B volume mix ratio for use in side-by-side dispensing cartridges and meter/mix and dispense equipment. EP1112NC Black will reach full cure at room temperature within 6 to 12 hours. Cure time can be accelerated by the application of heat after product has gelled. Times and temperatures from 1 hour at 65°C to 10 minutes at 100°C are typical for small castings (less than 50 grams).

Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

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Physical PropertiesMetricEnglishComments
Specific Gravity 0.960 g/cc0.960 g/ccPart B; TM R050-16
 1.04 g/cc1.04 g/ccMixed; TM R050-16
 1.12 g/cc1.12 g/ccPart A; TM R050-16
Water Absorption 0.40 %
@Time 86400 sec
0.40 %
@Time 24.0 hour
TM R050-35
Viscosity 1200 cP1200 cPPart A, RVT, #2, 20 rpm; TM R050-12
 1200 cP1200 cPPart B, RVT, #2, 20 rpm; TM R050-12
 1200 cP1200 cPMixed; TM R050-12
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7070TM R050-17
Tensile Strength at Break 11.0 MPa1600 psiTM R050-36
Tensile Strength, Ultimate 11.7 MPa1700 psiTM R050-36
Tensile Strength, Yield 6.21 MPa900 psiTM R050-36
Elongation at Break 50 %50 %TM R050-36
Tensile Modulus 0.414 GPa60.0 ksiTM R050-36
Compressive Yield Strength 8.27 MPa1200 psiTM R050-38
Compressive Strength 124 MPa18000 psiBreak; TM R050-38
 128 MPa18500 psiUltimate; TM R050-38
Compressive Modulus 0.483 GPa70.0 ksiTM R050-38
Adhesive Bond Strength 6.89 MPa1000 psiLap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 8.00e+14 ohm-cm8.00e+14 ohm-cm
Dielectric Constant 4.2
@Frequency 100 Hz,
Temperature 25.0 °C
4.2
@Frequency 100 Hz,
Temperature 77.0 °F
Dielectric Strength 16.1 kV/mm410 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear 60.0 µm/m-°C33.3 µin/in-°F
Thermal Conductivity 0.140 W/m-K0.972 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 121 °C250 °F
Minimum Service Temperature, Air -40.0 °C-40.0 °F
Glass Transition Temp, Tg 48.0 °C118 °FTM R050-25
 
Processing PropertiesMetricEnglishComments
Pot Life 8.0 - 12 min8.0 - 12 minMass: 50g; TM R050-19
 
Descriptive Properties
ColorBlack
Mix Ratio1:1Volume
 100:85Weight

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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PRESL099 / 101513

Metal adhesives

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