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Conventus Polymers DURALON PK3000 Aliphatic Polyketone
Conventus Polymers DURALOX GP1000 PBT
Conventus Polymers DURALOX PBT GF15 IM PBT, impact-modified glass filled
Conventus Polymers DURALOX PBT IM PBT, impact-modified
Conventus Polymers DURAMIDE PA66GF33 Nylon 66, 33% glass fiber
Conventus Polymers DURAMIDE PA66LGF50 Nylon 66, 50% long glass fiber filled
Conventus Polymers Duramide™ 6XMG35 Nylon
Conventus Polymers Duramide™ PA301R-BK High Impact Nylon 6/6
Conventus Polymers Duramide™ PA66 LGF40MAX Nylon 66, 40% Long Glass Fiber Reinforced
Conventus Polymers Duramide™ PA66GF14T Nylon 66, 14% Glass Fiber Reinforced, Impact Modified
Conventus Polymers Duramide™ PA66GF30 Nylon 66, 30% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA66GF33HI Nylon 66, 33% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA66GF33LS Nylon 66, 33% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA66IMXHSU Nylon 66, Impact Grade
Conventus Polymers Duramide™ PA66L BK Nylon 66
Conventus Polymers Duramide™ PA66L Nylon 66
Conventus Polymers Duramide™ PA66LGF60BK Nylon 66, 60% Long Glass Fiber Reinforced, Heat Stabilized
Conventus Polymers Duramide™ PA66MIFDNT Nylon 66, Impact Modified
Conventus Polymers Duramide™ PA66SI Nylon 66
Conventus Polymers Duramide™ PA6BKLIND Nylon 6
Conventus Polymers Duramide™ PA6BKUV Nylon 6, UV Stabilized
Conventus Polymers Duramide™ PA6CF20IMBK Nylon 6, 20% Carbon Fiber Reinforced
Conventus Polymers Duramide™ PA6GF13UBK Nylon 6, 13% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6GF15 Nylon 6, 15% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6GF20 Nylon 6, 20% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6GF33BK Nylon 6, 33% Glass Fiber Reinforced, Heat Stabilized
Conventus Polymers Duramide™ PA6GF33HI Nylon 6, 33% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6GF33NT Nylon 6, 33% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6GF60NT Nylon 6, 60% Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6L Nylon 6
Conventus Polymers Duramide™ PA6LGF50IMBK Nylon 6, 50% Long Glass Fiber Reinforced
Conventus Polymers Duramide™ PA6NAT Nylon 6
Conventus Polymers DuraPEEK 1000 NC PEEK
Conventus Polymers DuraPEEK 1000BG PEEK, Graphite/Carbon/PTFE Reinforced
Conventus Polymers DuraPEEK 1000C PEEK
Conventus Polymers DuraPEEK 1000CC20 PEEK
Conventus Polymers DuraPEEK 1000CC30 PEEK, 30% Ceramic Filled
Conventus Polymers DuraPEEK 1000CF30 30% Carbon Fiber Reinforced PEEK
Conventus Polymers DuraPEEK 1000GF30 30% Glass Fiber Reinforced PEEK
Conventus Polymers DuraPEEK 1000HF PEEK
Conventus Polymers DuraPEEK 1000HFGF30 PEEK, 30% Glass Fiber Reinforced
Conventus Polymers DuraPEEK 1000HFP PEEK
Conventus Polymers DuraPEEK 1000IND NC PEEK
Conventus Polymers DuraPEEK 1000SHF PEEK
Conventus Polymers DuraPEEK 1000TF40 PEEK
Conventus Polymers DuraPEEK 1000U PEEK
Conventus Polymers DuraPEEK 1000WC PEEK
Conventus Polymers DuraPEEK 3000 PEEK
Conventus Polymers DuraPEEK 3000IND PEEK
Conventus Polymers DuraPEEK LS30GF1 30% Glass Fiber Reinforced, PEEK
Conventus Polymers DuraPEEK LS30GF2 30% Glass Fiber Reinforced, PEEK
Conventus Polymers DuraPEEK PEEKLGF50 50% Long Glass Fiber Reinforced, PEEK
Conventus Polymers DuraPEEK XL1000 PEEK
Conventus Polymers DURATEMP PEI30CFBK Polyetherimide compound, 30% carbon fiber filled
Conventus Polymers DURATOUGH PC09309 Polycarbonate, mineral filled, high dielectric constant
Conventus Polymers DURATOUGH PC10FD Polycarbonate, 10 melt, food contact grade
Conventus Polymers DURATOUGH PC18UR Polycarbonate, general purpose 18 melt, mold release and UV stabilizers
Conventus Polymers DURATOUGH XR PC2289 Polycarbonate, injection molding
Conventus Polymers ELECTRAFORCE EXPA66CF35IU BK Nylon 66, 60% Long Glass Fiber Reinforced
Cookson Group Plaskon® 1002 Conventional Encapsulant
Cookson Group Plaskon® 1031 Conventional Encapsulant
Cookson Group Plaskon® 150.401 Encapsulation Resin
Cookson Group Plaskon® 2929BNSC Epoxy Molding Compound
Cookson Group Plaskon® 3100 Novolac Epoxy Molding Compound
Cookson Group Plaskon® 3100LS Mineral Filled Conventional Encapsulant
Cookson Group Plaskon® 3200LS Mineral Filled Novolac Epoxy Molding Compound
Cookson Group Plaskon® 3300S Mineral Filled Novolac Epoxy Molding Compound
Cookson Group Plaskon® 3300SGH Mineral Filled Epoxy Molding Compound
Cookson Group Plaskon® 3300SH Mineral Filled Epoxy Molding Compound
Cookson Group Plaskon® 3400 Epoxy Molding Compound
Cookson Group Plaskon® 3400-2 Conventional Encapsulant
Cookson Group Plaskon® 3400F Epoxy Molding Compound
Cookson Group Plaskon® 3400F-14 Conventional Encapsulant
Cookson Group Plaskon® 3400FP Epoxy Molding Compound
Cookson Group Plaskon® 435 Mineral Filled Epoxy Molding Compound
Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound
Cookson Group Plaskon® 440S Mineral Filled Novolac Epoxy Molding Compound
Cookson Group Plaskon® 7060 Conventional Encapsulant
Cookson Group Plaskon® 7090 Conventional Encapsulant
Cookson Group Plaskon® 7115 Conventional Encapsulant
Cookson Group Plaskon® ALP-2 (188.pcs03) Thin Package Encapsulant
Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant
Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound
Cookson Group Plaskon® AMC-2RA Low Stress Epoxy Molding Compound
Cookson Group Plaskon® AMC-2RC Low Stress Epoxy Molding Compound
Cookson Group Plaskon® CMU-870-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-870-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® CMU-880-MA Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® LS-16 Low Stress Epoxy Molding Compound
Cookson Group Plaskon® LS-16S Molding Compound
Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® MUF-2A Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® MUF-2B Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® MUF-2C Molded Underfill Compound for Flip Chip BGAs and CSPs
Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green
Cookson Group Plaskon® NXG-1 Molding Compound for PBGAs
Cookson Group Plaskon® NXG-1FP Molding Compound for Fine Pitch Applications
Cookson Group Plaskon® NXG-1HS Molding Compound for Heat Spreader Applications
Cookson Group Plaskon® NXG-1LAR Low Alpha Molding Compound for PBGAs
Cookson Group Plaskon® PPF-165 Conventional Epoxy Molding Compound
Cookson Group Plaskon® PPF-165A Molding Compound
Cookson Group Plaskon® S-7 Low Stress Epoxy Encapsulant
Cookson Group Plaskon® S-7LA Molding Compound
Cookson Group Plaskon® S-7P Epoxy Encapsulant
Cookson Group Plaskon® S-7PG Low Stress Epoxy Encapsulant
Cookson Group Plaskon® S-7S Epoxy Encapsulant
Cookson Group Plaskon® SE3001 Silver Filled Epoxy
Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B1 Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1F Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1FX (146.801) Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1FX Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1LAR Low Alpha, Fast Curing Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1LV Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1NLV Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1RC (146.403) Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1RC Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-1™ Epoxy Molding Compound for PBGAs
Cookson Group Plaskon® SMT-B-2 Molding Compound for PBGA and CSP
Cookson Group Plaskon® SMT-B-2FP Molding Compound for PBGA and CSP
Cookson Group Plaskon® SMT-B-2FPI Molding Compound for PBGA and CSP
Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant
Cookson Group Plaskon® ULS-12HLG Epoxy Encapsulant
Cookson Group Plaskon® ULS-12LA Molding Compound
Cookson Group POLYSOLDER® LS One Part Electrically Conductive Adhesive Paste
Cookson Group POLYSOLDER® LT One Part Electrically Conductive Adhesive Paste
Cookson Group POLYSOLDER® LT Two Part Electrically Conductive Adhesive Paste
Cookson Group POLYSOLDER® LTD One Part Electrically Conductive Adhesive Paste
Cookson Group STAYCHIP® 2078E No-Flow Fluxing Underfill
Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure
Cookson Group STAYCHIP® 3082 High Reliability Flip Chip Underfill, Low CTE
Cookson Group STAYCHIP® 3083 Low Stress Underfill with Enhanced JEDEC Performance
Cookson Group STAYCHIP® 3090.mk.01 High Productivity Capillary Underfill
Cookson Group STAYCHIP® 3100 High Reliability Flip Chip Underfill
Cookson Group STAYCHIP® 3103 Low Stress Underfill with Enhanced JEDEC Performance
Cookson Group STAYCHIP® 3105 Low Stress Underfill for Large Die Flip Chip
Cookson Group STAYDRY® GA2000-2 Particle and Moisture Getter
Cookson Group STAYDRY® H2-3000 Hydrogen and Moisture Getter
Cookson Group STAYDRY® HiCap2000 High Capacity Moisture Getter
Cookson Group STAYDRY® SD1000 High Temperature Moisture Getter
Cookson Group STAYDRY® SD800 Low Temperature Moisture Getter
Cookson Group STAYSTIK® 101G Silver Filled Electrically Conductive Paste
Cookson Group STAYSTIK® 171 Silver Filled Electrically Conductive Paste
Cookson Group STAYSTIK® 181 Silver Filled Electrically Conductive Paste
Cookson Group STAYSTIK® 181G Silver Filled Electrically Conductive Paste
Cookson Group STAYSTIK® 211G Aluminum Nitride Filled Thermally Enhanced Paste
Cookson Group STAYSTIK® 272 Aluminum Nitride Filled Thermally Enhanced Paste
Cookson Group STAYSTIK® 282 Aluminum Nitride Filled Thermally Enhanced Paste
Cookson Group STAYSTIK® 282G Aluminum Nitride Filled Thermally Enhanced Paste
Cookson Group STAYSTIK® 301G Non-Filed Dielectric Interposer Paste
Cookson Group STAYSTIK® 336T Patented Technology
Cookson Group STAYSTIK® 371 Non-Filed Dielectric Interposer Paste
Cookson Group STAYSTIK® 383 Non-Filed Dielectric Interposer Paste
Cookson Group STAYSTIK® 383G Non-Filed Dielectric Interposer Paste
Cookson Group STAYSTIK® 415 Non-Filed Dielectric Interposer Film
Cookson Group STAYSTIK® 472 Non-Filed Dielectric Interposer Film
Cookson Group STAYSTIK® 482 Non-Filed Dielectric Interposer Film
Cookson Group STAYSTIK® 492 Non-Filed Dielectric Interposer Film
Cookson Group STAYSTIK® 501 Silver Filled Electrically Conductive Film
Cookson Group STAYSTIK® 571 Silver Filled Electrically Conductive Film
Cookson Group STAYSTIK® 581 Silver Filled Electrically Conductive Film
Cookson Group STAYSTIK® 591 Silver Filled Electrically Conductive Film
Cookson Group STAYSTIK® 611 Aluminum Nitride Filled Thermally Enhanced Film
Cookson Group STAYSTIK® 672 Aluminum Nitride Filled Thermally Enhanced Film
Cookson Group STAYSTIK® 682 Aluminum Nitride Filled Thermally Enhanced Film
Cookson Group STAYSTIK® 692 Aluminum Nitride Filled Thermally Enhanced Film
Cookson Group STAYSTIK® 701G Alumina Filled "Low Flow" Dielectric Paste
Cookson Group STAYSTIK® 773 Alumina Filled "Low Flow" Dielectric Paste
Cookson Group STAYSTIK® 783 Alumina Filled "Low Flow" Dielectric Paste
Cookson Group STAYSTIK® 783G Alumina Filled "Low Flow" Dielectric Paste
Cookson Group STAYSTIK® 811 Alumina Filled "Low Flow" Dielectric Film
Cookson Group STAYSTIK® 872 Alumina Filled "Low Flow" Dielectric Film
Cookson Group STAYSTIK® 882 Alumina Filled "Low Flow" Dielectric Film
Cookson Group STAYSTIK® 892 Alumina Filled "Low Flow" Dielectric Film
Cookson Group STAYSTIK® Resin E Patented Technology Paste
CoorsTek ACI-Co10 Tungsten Carbide
CoorsTek ACI-Co6 Tungsten Carbide
CoorsTek ACI-Ni10 Tungsten Carbide
CoorsTek ACI-Ni6 Tungsten Carbide
CoorsTek AD-85 Alumina (nom. 85% Al
2
O
3
)
CoorsTek AD-90 Alumina (nom. 90% Al
2
O
3
)
CoorsTek AD-94 Alumina (nom. 94% Al
2
O
3
)
CoorsTek AD-96 Alumina (nom. 96% Al
2
O
3
)
CoorsTek AD-995 Alumina (nom. 99.5% Al
2
O
3
)
CoorsTek AD-995-I2 Nom. 99.5% Al
2
O
3
CoorsTek AD-995-I4 Min. 99.5% Al
2
O
3
CoorsTek AD-995-LT Nom. 99.5% Al
2
O
3
CoorsTek AD-996 99.6% Alumina
CoorsTek AD-996-SI Min. 99.5% Al
2
O
3
CoorsTek AD-998 Alumina(nom. 99.8% Al
2
O
3
)
CoorsTek AD-999 Nom. 99.9% Al
2
O
3
CoorsTek ADD-96 96% Alumina
CoorsTek ADO-96 Nom. 96% Al
2
O
3
CoorsTek ADOS-90R 91% Alumina Thick Film Substrate
CoorsTek ADS 11 Advanced Alumina
CoorsTek ADS-12 Min. 99.5% Al
2
O
3
CoorsTek ADS-96R 96% Alumina Thick Film Substrate
CoorsTek ADS-995 99.5% Alumina Thin Film
CoorsTek ADS-995R MidFilm™ 99.5% Alumina Thick Film
CoorsTek ADS-996 99.6% Alumina Thin Film
CoorsTek ADSR-96R DuraStrate™ 96% Alumina Thick Film
CoorsTek AIN 140 Aluminum Nitride
CoorsTek AIN 180 Aluminum Nitride
CoorsTek AIN-170 Hot Pressed Aluminum Nitride
CoorsTek Alumina-Zirconia Composite, AZ-25
CoorsTek AZ-67 Zirconia Toughened Alumina
CoorsTek AZ-93 Zirconia Toughened Alumina
CoorsTek CAP 3 99.5% Alumina Ceramic Armor Material
CoorsTek CAP 4 98.5% Alumina Ceramic Armor Material
CoorsTek Cerapure™ Alumina Plus High-Purity Ceramic, Nom. 99.8% Al
2
O
3
CoorsTek CeraSiC® -B Direct Sintered Silicon Carbide
CoorsTek Cercom® ALN HP Hot Pressed
CoorsTek Cercom® ALN S-1 Direct Sintered High Resistance
CoorsTek Cercom® PAD B4C Pressure Assisted Densification Boron Carbide
CoorsTek Cercom® PAD B4C-SIC Pressure Assisted Densification Boron Carbide w/ Silicon Carbide
CoorsTek Cercom® PAD EBON-A Pressure Assisted Densification Black Alumina
CoorsTek Cercom® PAD SIC X-1 Pressure Assisted Densification BallisticGrade Silicon Carbide
CoorsTek Cercom® PAD SIC-B4C Pressure Assisted Densification SiC with Boron Carbide
CoorsTek Cercom® PAD SIC-N Pressure Assisted Densification Silicon Carbide
CoorsTek Cercom® PAD SPINEL Pressure Assisted Densification Spinel
CoorsTek Cercom® PAD TIB2 Pressure Assisted Densification Titanium Diboride
CoorsTek CORDIERITE Ceramic
CoorsTek CRB-100 Resin-Impregnated Carbon Graphite
CoorsTek CRB-200 Resin-Impregnated Carbon Graphite
CoorsTek CRB-300 General-Duty Carbon Graphite
CoorsTek CRB-400 Antimony-Impregnated Carbon Graphite
CoorsTek CRB-500 Medium Strength Carbon Graphite
CoorsTek CRB-600 Resin-Bonded Carbon Graphite
CoorsTek DuraSense™ Ceramic Alumina Toughened Zirconia
CoorsTek Dura-Z™ MgO Partially Stabilized Zirconia
CoorsTek Epoxy Seal 216 (ES-216) B-staged epoxy lids
CoorsTek Epoxy Seal 923 (ES-923) B-staged epoxy lids
CoorsTek ESD Alumina Ceramic
CoorsTek EXYRA™ BULK YTTRIA Min. 99.9% Y
2
O
3
CoorsTek FG-98 98% Alumina Ceramic Armor Material
CoorsTek FG-995 Alumina (nom. 98.5% Al
2
O
3
)
CoorsTek FUSED QUARTZ Min. 99.99% SiO
2
CoorsTek Hot Pressed Aluminum Nitride
CoorsTek HPB4C Hot Pressed Boron Carbide
CoorsTek Mullite, S2
CoorsTek NBD-200 Silicon Nitride (Glass HIPped)
CoorsTek Nitrogen Bonded Silicon Carbide, SCNB
CoorsTek NT 154 High Temp Silicon Nitride (Glass HIPed)
CoorsTek PAD Si
3
N
4
NSG Pressure Assisted Densification Nuclear Seal Grade
CoorsTek PlasmaPure™ AD-998 Alumina (nom. 99.8% Al
2
O
3
)
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