This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provides a lower viscosity with higher flow characteristics than SMT-B- 1. It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays. Features: - Improved wire sweep performance
- Low stress
- Minimal warpage
- Outstanding high temperature flexural strength
Information provided by Cookson Electronics |