Cookson Group Plaskon® SMT-B-2 Molding Compound for PBGA and CSP

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Cookson Group Plaskon® SMT-B-2 Molding Compound for PBGA and CSP (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 260°C IR reflow temperatures. Features: Lower moisture pickup Excellent moldability Low wire sweep Fast cure Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.94 g/cc	1.94 g/cc
Moisture Absorption at Equilibrium	0.35 %	0.35 %	at 85°C/85% RH, 168 hours
Viscosity	5500 cP @Temperature 175 °C	5500 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	140 cm	55.1 in	at 175°C and 1000 psi
Ash	85.5 %	85.5 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	Cull hot
Flexural Strength	103.0 MPa	14930 psi
	21.574 MPa @Temperature 240 °C	3129.1 psi @Temperature 464 °F
Flexural Modulus	18.14 GPa	2631 ksi
	1.765 GPa @Temperature 240 °C	256.0 ksi @Temperature 464 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+12 ohm-cm @Temperature 150 °C	>= 1.00e+12 ohm-cm @Temperature 302 °F
	>= 1.00e+15 ohm-cm @Temperature 22.0 °C	>= 1.00e+15 ohm-cm @Temperature 71.6 °F
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	10.0 µm/m-°C @Temperature 20.0 °C	5.56 µin/in-°F @Temperature 68.0 °F	Alpha 1
	50.0 µm/m-°C @Temperature 20.0 °C	27.8 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	170 °C	338 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	5.17 - 8.62 MPa	750 - 1250 psi
Cure Time	1.17 - 2.00 min	0.0194 - 0.0333 hour	In mold
	0.000 - 180 min @Temperature 175 °C	0.000 - 3.00 hour @Temperature 347 °F	Post mold
Gel Time	0.300 min	0.300 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	0.250 Month	at 22°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
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PPLASK010 / 56300

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