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Ensinger PEI

Solvay CYCOM® 5250-4 RTM BMI Resin, Unreinforced
Categories: Polymer; Thermoset; Bismaleimide (BMI)

Material Notes: CYCOM® 5250-4 RTM is a true one-part homogeneous BMI resin developed specifically for the resin transfer molding (RTM) process. It reaches very low viscosity during transfer and maintains a low viscosity for several hours, thus providing the maximum capability to fabricate complex parts. Laminates fabricated from CYCOM 5250-4 RTM are capable of service temperatures up to 400°F (204°C), but its toughness and processability make it an ideal material for 180°F (82°C) temperature applications where epoxies are commonly used. CYCOM 5250-4 RTM offers the highest open hole compression (OHC) value of any organic matrix resin while providing the highest level of toughness available in an RTM capable matrix resin.

Features & Benefits:

  • Excellent toughness
  • Maximum continuous service temperature up to 400°F (204°C)
  • Superior hot/wet properties at 160 to 375°F (71 to190°C)
  • Low viscosity during processing
  • Low-tack, solid at room temperature provides ease of handling
  • Low thermal conductivity
  • Versatile cure, can be cured at 400°F (204°C) for 2 hours
  • Out-time greater than 60 days at room temperature
  • True one-part formulation
  • Fully compatible CYCOM 5240-4 RTM low resin content prepregs and CYCOM 782 RTM bindercoated fabrics are available for preform manufacture
Applications:
  • Wing stabilizer spars
  • Fuselage skins and stiffeners
  • Low operating temperature, critical load-bearing components
  • Engine components

Information provided by Cytec, subsequently acquired by Solvay.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.25 g/cc0.0452 lb/in³Standard Cure
 1.25 g/cc0.0452 lb/in³Cure 204°C for 2 hrs no post cure
Water Absorption  3.9 %
@Temperature 71.1 °C,
Time 3.60e+6 sec
3.9 %
@Temperature 160 °F,
Time 1000 hour
Cure 204°C for 2 hrs no post cure
 4.2 %
@Temperature 71.1 °C,
Time 3.60e+6 sec
4.2 %
@Temperature 160 °F,
Time 1000 hour
Standard Cure
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 103 MPa14900 psiStandard Cure
 103 MPa15000 psiCure 204°C for 2 hrs no post cure
Elongation at Break 4.8 %4.8 %Standard Cure
 4.9 %4.9 %Cure 204°C for 2 hrs no post cure
Tensile Modulus 4.60 GPa667 ksiStandard Cure
 4.60 GPa667 ksiCure 204°C for 2 hrs no post cure
Flexural Strength 162 MPa23500 psiCure 204°C for 2 hrs no post cure
 163 MPa23600 psiStandard Cure
Fracture Toughness 0.850 MPa-m½0.774 ksi-in½K1C Notch Sensitivity
Charpy Impact Unnotched 20.4 J/cm²97.0 ft-lb/in²Standard Cure
 
Thermal PropertiesMetricEnglishComments
CTE, linear 44.0 µm/m-°C24.4 µin/in-°FResin after standard cure + postcure
Maximum Service Temperature, Air 204 °C399 °Fcontinuous
Glass Transition Temp, Tg 199 °C390 °FCure 204°C for 2 hrs-no postcure, wet
 207 °C405 °FStandard Cure+Standard Postcure, wet
 254 °C489 °FCure 204°C for 2 hrs-no postcure, dry
 271 °C520 °FStandard Cure+Standard Postcure, dry
 
Processing PropertiesMetricEnglishComments
Processing Temperature  177 - 191 °C
@Time 21600 sec
350 - 375 °F
@Time 6.00 hour
Standard Cure. Standard post cure is 440°F for 4 hours
 <= 204 °C
@Time 7200 sec
<= 400 °F
@Time 2.00 hour
optional cure (no postcure)
Gel Time 35.0 min
@Temperature 177 °C
35.0 min
@Temperature 351 °F
Shelf Life 6.00 Month
@Temperature <=-17.8 °C
6.00 Month
@Temperature <=0.000 °F
sealed container

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PCYTED079 / 180381

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