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Master Bond adhesives

Copper Bromide, CuBr, Cubic
Categories: Ceramic; Halide; Other Engineering Material; Semiconductor

Key Words: Halide; Semiconductor
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Physical PropertiesMetricEnglishComments
Density 4.98 g/cc0.180 lb/in³
a Lattice Constant 5.6905 Å5.6905 Å
Molecular Weight 143.45 g/mol143.45 g/mol
Volume Compressibility, 10^-10 m²/N 0.260.26
 
Mechanical PropertiesMetricEnglishComments
Hardness, Mohs 2.52.5
 
Electrical PropertiesMetricEnglishComments
Magnetic Susceptibility -0.0000490-0.0000490cm^3/mol
Dielectric Constant 7.97.9
Band Gap 2.94 eV2.94 eV
 
Thermal PropertiesMetricEnglishComments
Heat of Fusion 67.0 J/g28.8 BTU/lbCrystal structure not specified.
 467.1 J/g200.9 BTU/lbCrystal structure not specified
CTE, linear 15.4 µm/m-°C
@Temperature 20.0 °C
8.56 µin/in-°F
@Temperature 68.0 °F
Specific Heat Capacity 0.381 J/g-°C0.0911 BTU/lb-°F
Thermal Conductivity 1.25 W/m-K8.68 BTU-in/hr-ft²-°F
Melting Point 497 °C927 °F
Boiling Point 1345 °C2453 °F
Heat of Formation 481 kJ/mol481 kJ/mol
Debye Temperature -66.0 °C-86.8 °F
 
Optical PropertiesMetricEnglishComments
Refractive Index 2.122.12
 
Descriptive Properties
CAS Number7787-70-4
ColorWhite
Crystal StructureCubicSphalerite Structure - Space Group F(-4)3m

References for this datasheet.

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DSEM51 / 2966

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