Lord Adhesives CoolTherm™ SC-6710/6730 Silicone Resin System

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Lord Adhesives CoolTherm™ SC-6710/6730 Silicone Resin System
Categories:	Polymer; Thermoset; Silicone; Silicone, RTV, Encapsulation Grade
Material Notes:	LORD CoolTherm™ SC-6710/6732 silicone system is a two-component, RTV silicone system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones. Features: maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials. exhibits low shrinkage and stress on components as it cures. room temperature curing formulation is not subject to hardener poisoning. provides thermal conductivity for applications where rapid heat dissipation is required. can be used on parts and devices that experience operating temperatures from -55°C to +200°C. All information provided by Lord.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	2.15 g/cc @Temperature 25.0 °C	2.15 g/cc @Temperature 77.0 °F
Viscosity	20000 cP @Temperature 25.0 °C	20000 cP @Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	65	65	cured
Tensile Strength	5.52 MPa @Temperature 25.0 °C	800 psi @Temperature 77.0 °F	cured
Elongation at Break	100 %	100 %	cured

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm @Temperature 25.0 °C	1.00e+14 ohm-cm @Temperature 77.0 °F	cured
Dielectric Constant	5.3 @Temperature 25.0 °C	5.3 @Temperature 77.0 °F	cured
Dielectric Strength	19.7 kV/mm	500 kV/in	cured
Dissipation Factor	0.020 @Temperature 25.0 °C	0.020 @Temperature 77.0 °F	cured

Thermal Properties	Metric	English	Comments
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F	cured
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Cure Time	30.0 - 60.0 min @Temperature 65.0 °C	0.500 - 1.00 hour @Temperature 149 °F
Working Life	60.0 - 120 min @Temperature 25.0 °C	60.0 - 120 min @Temperature 77.0 °F	Mixed
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F	each component from date of manufacture

Descriptive Properties
Appearance	Red Liquid
Mix Ratio	100 to 5		by weight, resin to hardener

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Lord Adhesives CoolTherm™ SC-324 Thermally Conductive Epoxy Encapsulant
Lord Adhesives CoolTherm™ SC-322 Thermally Conductive Adhesive
Lord Adhesives CoolTherm™ SC-320 THK Thermally Conductive Silicone
Lord Adhesives CoolTherm™ SC-320 Thermally Conductive Silicone Encapsulant
Lord Adhesives CoolTherm™ SC-320 SLW Thermally Conductive Silicone Encapsulant

PLORD9271 / 232627

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message