Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1LAS Low Alpha Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications. Features: Minimal warpage Low stress Low viscosity Low alpha particle content Outstanding high temperature flexural strength Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.88 g/cc	1.88 g/cc
Viscosity	4500 cP @Temperature 175 °C	4500 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.00050 cm/cm	0.00050 in/in
Spiral Flow	140 cm	55.1 in	at 177°C and 1000 psi
Ash	77 %	77 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	Cull hot, 90 sec @ 175°C
Flexural Strength	107.9 MPa	15650 psi
	44.130 MPa @Temperature 215 °C	6400.5 psi @Temperature 419 °F
Flexural Modulus	13.73 GPa	1991 ksi
	5.884 GPa @Temperature 215 °C	853.4 ksi @Temperature 419 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm @Temperature 22.0 °C	>= 1.00e+15 ohm-cm @Temperature 71.6 °F
Dielectric Constant	3.7 @Frequency 1000 Hz	3.7 @Frequency 1000 Hz
Dielectric Strength	15.7 kV/mm	400 kV/in
Dissipation Factor	0.0021 @Frequency 1000 Hz	0.0021 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	8.89 µin/in-°F @Temperature 68.0 °F	Alpha 1
	68.0 µm/m-°C @Temperature 20.0 °C	37.8 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	220 °C	428 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	34 %	34 %

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	5.17 - 6.89 MPa	750 - 1000 psi
Cure Time	2.00 - 3.00 min @Temperature 177 °C	0.0333 - 0.0500 hour @Temperature 351 °F
	240 - 300 min @Temperature 175 °C	4.00 - 5.00 hour @Temperature 347 °F	Post mold
Gel Time	0.250 min	0.250 min	Ram follower, at 177°C and 1000 psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Alpha Particle Count	<0.001 counts/cm2/hr
Hydrolyzable Cl	<1 ppm
Preheat Temperature	90-100°C

**
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PPLASK006 / 56296

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