Cookson Group Plaskon® PPF-165A Molding Compound

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Cookson Group Plaskon® PPF-165A Molding Compound (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A conventional molding compound specifically formulated for semiconductor devices which are molded with preplated leadframes. Low temperature molding; Limited, if any, post mold cure; Fast cure rate; Low viscosity for consistent, reproducible moldability; Outstanding reliability; Excellent shelf life; PPF-165A is a low lube version for reduced cleaning frequency
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Physical Properties	Metric	English	Comments

Density	1.80 g/cc	0.0650 lb/in³
Viscosity	11000 cP @Temperature 175 °C	11000 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0030 cm/cm	0.0030 in/in
Spiral Flow	72.0 cm	28.3 in	165°C/1000 psi

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80
Flexural Strength	124 MPa	18000 psi
Flexural Modulus	15.0 GPa	2180 ksi

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.5 @Frequency 1000 Hz	3.5 @Frequency 1000 Hz
Dielectric Strength	16.0 kV/mm	406 kV/in
Dissipation Factor	0.0030 @Frequency 1000 Hz	0.0030 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec

Thermal Properties	Metric	English	Comments
CTE, linear	21.0 µm/m-°C @Temperature 20.0 °C	11.7 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	67.0 µm/m-°C @Temperature 20.0 °C	37.2 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.600 W/m-K	4.16 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	157 °C	315 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Processing Properties	Metric	English	Comments
Processing Temperature	165 - 175 °C	329 - 347 °F	Molding temperature

**
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PCOOK321 / 21417

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