Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant

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Cookson Group Plaskon® ALP-2 (197.sh03) Thin Package Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP’s. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes. Features: Very low moisture pickup Good marketability Good moldability Fast cure Outstanding device reliability Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.98 g/cc	1.98 g/cc
Moisture Absorption at Equilibrium	0.23 %	0.23 %	at 85°C/85% RH, 168 hours
Viscosity	4300 cP @Temperature 175 °C	4300 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	90.0 cm	35.4 in	at 175°C and 1000 psi
Ash	87 %	87 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	79	79	Cull hot
Flexural Strength	119.6 MPa	17350 psi
	10.788 MPa @Temperature 260 °C	1564.6 psi @Temperature 500 °F
Flexural Modulus	22.22 GPa	3223 ksi
	1.030 GPa @Temperature 260 °C	149.3 ksi @Temperature 500 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+9 ohm-cm @Temperature 150 °C	>= 1.00e+9 ohm-cm @Temperature 302 °F
	>= 1.00e+12 ohm-cm @Temperature 22.0 °C	>= 1.00e+12 ohm-cm @Temperature 71.6 °F
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz
Dielectric Strength	>= 55.1 kV/mm	>= 1400 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	9.80 µm/m-°C @Temperature 20.0 °C	5.44 µin/in-°F @Temperature 68.0 °F	Alpha 1
	39.3 µm/m-°C @Temperature 20.0 °C	21.8 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	1.00 W/m-K	6.94 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	146 °C	295 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	5.17 - 8.62 MPa	750 - 1250 psi
Cure Time	1.17 - 2.00 min	0.0194 - 0.0333 hour	In mold
	0.000 - 240 min @Temperature 175 °C	0.000 - 4.00 hour @Temperature 347 °F	Post mold
Gel Time	0.283 min	0.283 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0167 Month	0.0167 Month	at 35°C, <40% loss of spiral flow
	0.0670 Month	0.0670 Month	at 22°C, <40% loss of spiral flow
	6.00 Month	6.00 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
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PPLASK017 / 56307

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