Aptek 6109-A/B Epoxy Encapsulant

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Aptek 6109-A/B Epoxy Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Optoelectronic grade flexible water clear encapsulant. Higher viscosity/lower Tg version for clear blob-top encapsulation of ceramic substrate devices Part A is blue. Part B is clear to pale yellow. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	1.15 g/cc	0.0415 lb/in³	A Component; ASTM D1475
	1.20 g/cc	0.0434 lb/in³	B Component; ASTM D1475
Viscosity	350 cP	350 cP	B Component; Spindle #2; speed 50 rpm; ASTM D1824
	20000 cP	20000 cP	A Component; Spindle #5; speed 10 rpm; ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	82	82	Cured property; ASTM D2240

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+14 ohm-cm	>= 1.00e+14 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.8 @Frequency 1000 Hz	3.8 @Frequency 1000 Hz	Cured property; ASTM D150
Dissipation Factor	0.015 @Frequency 1000 Hz	0.015 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	99.0 µm/m-°C @Temperature 20.0 °C	55.0 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	225 µm/m-°C @Temperature 20.0 °C	125 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg	84.0 °C	183 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 150 °C	>= 302 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Optical Properties	Metric	English	Comments
Refractive Index	1.48	1.48	B Component
	1.538	1.538	Mixed Liquid
	1.57	1.57	A Component

Processing Properties	Metric	English	Comments
Processing Temperature	115 °C	239 °F	Cure 8 hrs.

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