Cookson Group Plaskon® SMT-B-1FX Molding Compound for PBGAs

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Cookson Group Plaskon® SMT-B-1FX Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications. Features: Faster cure speed Improved wire sweep performance Improved warp performance High HSTL performance Lower viscosity Reduced cure time Information provided by Cookson Electronics
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	1.89 g/cc	1.89 g/cc
Viscosity	5400 cP @Temperature 175 °C	5400 cP @Temperature 347 °F	Automatic orifice Viscosity
Spiral Flow	103 cm	40.6 in	at 175°C and 1000 psi
Ash	81 %	81 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	81	81	Cull hot, 75 sec @ 175°C
Flexural Strength	97.09 MPa	14080 psi
	34.323 MPa @Temperature 215 °C	4978.2 psi @Temperature 419 °F
Flexural Modulus	15.20 GPa	2205 ksi
	4.609 GPa @Temperature 215 °C	668.5 ksi @Temperature 419 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	3.20e+16 ohm-cm @Temperature 22.0 °C	3.20e+16 ohm-cm @Temperature 71.6 °F
Dielectric Constant	3.9 @Frequency 1000 Hz	3.9 @Frequency 1000 Hz
Dielectric Strength	27.6 kV/mm	700 kV/in
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	13.0 µm/m-°C @Temperature 20.0 °C	7.22 µin/in-°F @Temperature 68.0 °F	Alpha 1
	53.0 µm/m-°C @Temperature 20.0 °C	29.4 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	218 °C	424 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	32 %	32 %

Processing Properties	Metric	English	Comments
Mold Temperature	175 °C	347 °F
Back Pressure	5.52 - 8.27 MPa	800 - 1200 psi
Cycle Time - Injection	60 - 150 sec	60 - 150 sec
Cure Time	0.000 - 240 min @Temperature 175 °C	0.000 - 4.00 hour @Temperature 347 °F	Post mold
Gel Time	0.267 min	0.267 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm
Preheat Temperature	85-98°C

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

Users of our Advanced Search (registration required) may exclude discontinued materials from search results.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Tra-Con Tra-Bond 2153 Thermally Conductive Electrically Insulating Compound
Overview of materials for Epoxy Adhesive, Flexible
Atom Adhesives AA-DUCT 903 Epoxy Adhesive

PPLASK003 / 56293

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message