Lord Adhesives CoolTherm™ SC-6726 Thermally Conductive Silicone Encapsulant

Login to see your most recently viewed materials here. Or if you don't have an account with us yet, then click here to register.

Lord Adhesives CoolTherm™ SC-6726 Thermally Conductive Silicone Encapsulant
Categories:	Polymer; Thermoset; Silicone; Silicone Elastomer, for Thermal Management
Material Notes:	LORD CoolTherm™ SC-6726 encapsulant is a two-component, addition-cure silicone system for use in applications where high temperature service is required. CoolTherm SC-6726 encapsulant adheres to most substrates without the use of a primer. Features: can be used on parts and devices that experience operating temperatures from -55°C to +200°C. provides excellent reversion resistance at high temperatures; will not cause corrosion. All information provided by Lord.
Vendors:	No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
Printer friendly version Download as PDF Download to Excel (requires Excel and Windows) Export data to your CAD/FEA program Add to Folder:

Physical Properties	Metric	English	Comments

Specific Gravity	2.12 g/cc	2.12 g/cc	SC-6726 Hardener
	2.20 g/cc	2.20 g/cc	Mixed
	2.26 g/cc	2.26 g/cc	SC-6726 Resin
Viscosity	56000 cP @Temperature 25.0 °C	56000 cP @Temperature 77.0 °F	SC-6726 Resin
	56000 cP @Temperature 25.0 °C	56000 cP @Temperature 77.0 °F	SC-6726 Hardener
	56000 cP @Temperature 25.0 °C	56000 cP @Temperature 77.0 °F	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	70	70	cured
Tensile Strength	4.14 MPa @Temperature 25.0 °C	600 psi @Temperature 77.0 °F	cured
Elongation at Break	60 %	60 %	cured

Electrical Properties	Metric	English	Comments
Volume Resistivity	1.00e+14 ohm-cm	1.00e+14 ohm-cm	cured; ASTM D 257
Dielectric Constant	4.0 @Frequency 100 Hz	4.0 @Frequency 100 Hz	cured
Dielectric Strength	13.8 kV/mm	350 kV/in	cured
Dissipation Factor	0.020 @Frequency 100 Hz	0.020 @Frequency 100 Hz	cured

Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.800 W/m-K	5.55 BTU-in/hr-ft²-°F	cured
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-55.0 °C	-67.0 °F

Processing Properties	Metric	English	Comments
Pot Life	3.00 - 5.00 min @Temperature 25.0 °C	3.00 - 5.00 min @Temperature 77.0 °F	mixed, days
Shelf Life	6.00 Month @Temperature 25.0 °C	6.00 Month @Temperature 77.0 °F	each component, from date of manufacture when stored in original, unopened container

Descriptive Properties
Appearance	Grey Paste		SC-6726 Hardener
	Red Paste		SC-6726 Resin
	Red Paste		Mixed

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

Users viewing this material also viewed the following:
Lord Adhesives CoolTherm™ SC-324 Thermally Conductive Epoxy Encapsulant
Lord Adhesives CoolTherm™ SC-322 Thermally Conductive Adhesive
Lord Adhesives CoolTherm™ SC-320 THK Thermally Conductive Silicone
Lord Adhesives CoolTherm™ SC-320 Thermally Conductive Silicone Encapsulant
Lord Adhesives CoolTherm™ SC-320 SLW Thermally Conductive Silicone Encapsulant

PLORD9246 / 232602

	Advertise with MatWeb!
	Data sheets for over 180,000 metals, plastics, ceramics, and composites.
	HOME • SEARCH • TOOLS • SUPPLIERS • FOLDERS • ABOUT US • FAQ • LOG IN

System Message