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Flame Retardant adhesives

Cookson Group Plaskon® ALP-2 (188.pcs03) Thin Package Encapsulant  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes: This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP’s. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes.

Features:

  • Very low moisture pickup
  • Good moldability
  • Good markability
  • Fast cure
  • Outstanding device reliability

Information provided by Cookson Electronics
Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.92 g/cc1.92 g/cc
Moisture Absorption at Equilibrium 0.25 %0.25 %at 85°C/85% RH, 168 hours
Viscosity 5000 cP
@Temperature 175 °C		5000 cP
@Temperature 347 °F		Shimadzu Viscosity, 1000 psi
Spiral Flow 100 cm39.4 inat 175°C and 1000 psi
Ash 86 %86 %
Storage Temperature <= 5.00 °C<= 41.0 °FRecommended
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7070Cull hot
Flexural Strength 127.5 MPa18490 psi
 6.864 MPa
@Temperature 260 °C		995.6 psi
@Temperature 500 °F
Flexural Modulus 22.56 GPa3271 ksi
 0.7355 GPa
@Temperature 260 °C		106.7 ksi
@Temperature 500 °F
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  >= 1.00e+9 ohm-cm
@Temperature 150 °C		>= 1.00e+9 ohm-cm
@Temperature 302 °F
 >= 1.00e+12 ohm-cm
@Temperature 22.0 °C		>= 1.00e+12 ohm-cm
@Temperature 71.6 °F
Dielectric Constant 3.8
@Frequency 1e+6 Hz		3.8
@Frequency 1e+6 Hz
Dielectric Strength >= 1.400 kV/mm>= 35.56 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear  9.00 µm/m-°C
@Temperature 20.0 °C		5.00 µin/in-°F
@Temperature 68.0 °F		Alpha 1
 39.0 µm/m-°C
@Temperature 20.0 °C		21.7 µin/in-°F
@Temperature 68.0 °F		Alpha 2
Thermal Conductivity 1.00 W/m-K6.94 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 111 °C232 °F
Flammability, UL94 V-0
@Thickness 3.17 mm		V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 170 - 185 °C338 - 365 °F
Back Pressure 5.17 - 8.62 MPa750 - 1250 psi
Cure Time 1.17 - 2.00 min0.0194 - 0.0333 hour
 0.000 - 240 min
@Temperature 175 °C		0.000 - 4.00 hour
@Temperature 347 °F		Post mold
Gel Time 0.267 min0.267 minRam follower, at 175°C and 1000 psi
Shelf Life 0.0167 Month0.0167 Monthat 35°C, <40% loss of spiral flow
 0.0670 Month0.0670 Monthat 22°C, <40% loss of spiral flow
 6.00 Month6.00 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Halides<1 ppm

**
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PPLASK023 / 56313

Flame Retardant adhesives




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