Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound

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Aptek 6106-A/B Epoxy Encapsulant and/or Potting Compound
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. Lower Tg version, APTEK 6110-A/B, available for ceramic blob-top applications. Part A is hazy blue. Part B is water clear. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	0.950 g/cc	0.0343 lb/in³	B Component; ASTM D1475
	1.16 g/cc	0.0419 lb/in³	A Component; ASTM D1475
Viscosity	25 cP	25 cP	B Component; Spindle #1; speed 100 rpm; ASTM D1824
	2000 cP	2000 cP	A Component; Spindle #3; speed 10 rpm; ASTM D1824

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85	Cured property; ASTM D2240

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+15 ohm-cm	>= 1.00e+15 ohm-cm	Cured property; ASTM D257

Thermal Properties	Metric	English	Comments
CTE, linear	79.0 µm/m-°C @Temperature 20.0 °C	43.9 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1; Perkin Elmer TMS-2
	175 µm/m-°C @Temperature 20.0 °C	97.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2; Perkin Elmer TMS-2
Glass Transition Temp, Tg	>= 135 °C	>= 275 °F	Cured property; Perkin Elmer TMS-2
Flash Point	>= 100 °C	>= 212 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

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PAPTEK38 / 24200

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