Cookson Group Plaskon® 7090 Conventional Encapsulant

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Cookson Group Plaskon® 7090 Conventional Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a high thermal conductivity epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs and power devices. It was especially developed for balanced end use properties. Features Excellent moldability Superior cosmetics Improved markability Outstanding device reliability Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	2.10 g/cc	2.10 g/cc
Linear Mold Shrinkage	0.0070 cm/cm	0.0070 in/in
Spiral Flow	82.0 - 92.0 cm	32.3 - 36.2 in	at 177°C and 1000 psi
Ash	72.7 %	72.7 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	Cull hot, 90 sec @ 175°C
Flexural Strength	124.2 MPa	18010 psi
Flexural Modulus	13.788 GPa	1999.8 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	7.75e+15 ohm-cm	7.75e+15 ohm-cm
Dielectric Constant	5.0 @Frequency 1000 Hz	5.0 @Frequency 1000 Hz
Dielectric Strength	>= 11.8 kV/mm	>= 300 kV/in
Dissipation Factor	0.010 @Frequency 1000 Hz	0.010 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec	110V AC

Thermal Properties	Metric	English	Comments
CTE, linear	30.0 µm/m-°C @Temperature 20.0 °C	16.7 µin/in-°F @Temperature 68.0 °F	Alpha 1
	80.0 µm/m-°C @Temperature 20.0 °C	44.4 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	1.34 W/m-K	9.30 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	160 °C	320 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	28 %	28 %

Processing Properties	Metric	English	Comments
Mold Temperature	175 - 179 °C	347 - 354 °F
Back Pressure	5.17 - 6.89 MPa	750 - 1000 psi
Cure Time	1.00 - 2.00 min @Temperature 177 °C	0.0167 - 0.0333 hour @Temperature 351 °F
	120 min @Temperature 175 °C	2.00 hour @Temperature 347 °F	Post mold
Gel Time	0.167 - 0.300 min	0.167 - 0.300 min	Ram follower, at 177°C
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	100 ppm
Preheat Temperature	102-106°C

**
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PPLASK025 / 56315

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