Test specimens were transfer molded and post cured 4 hours at 175°C. A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs, QFPs, and SOICs. Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Outstanding device reliability |