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Chemically Resistant adhesives

Aptek 6550-A/B Epoxy Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: High thermal conductivity, microelectronic grade blob-top encapsulant. Ultra high purity. Excellent heat and moisture protection for sensitive chips/circuitry. Premixed frozen syringes available for robotic dispensers.

Part A is black. Part B is white.

Information provided by Aptek Laboratories, Inc.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Viscosity 190000 cP190000 cPA Component; Spindle #7; speed 10 rpm; ASTM D1824
 200000 cP200000 cPB Component; Spindle #7; speed 10 rpm; ASTM D1824
 
Chemical PropertiesMetricEnglishComments
Ionic Impurities - Na (Sodium) 15 ppm15 ppmHydrolyzable
Ionic Impurities - K (Potassium) 5.0 ppm5.0 ppmHydrolyzable
Ionic Impurities - Cl (Chloride) 15 ppm15 ppmHydrolyzable
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 9595Cured property; ASTM D2240
Adhesive Bond Strength 12.4 MPa1800 psiAl-to-Al Lap Shear; Cured property; ASTM D1002
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 7.50e+14 ohm-cm7.50e+14 ohm-cmCured property; ASTM D257
 
Thermal PropertiesMetricEnglishComments
CTE, linear  27.0 µm/m-°C
@Temperature 20.0 °C
15.0 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 1; Perkin Elmer TMS-2
 95.0 µm/m-°C
@Temperature 20.0 °C
52.8 µin/in-°F
@Temperature 68.0 °F
Cured property; alpha 2; Perkin Elmer TMS-2
Thermal Conductivity 1.21 W/m-K8.41 BTU-in/hr-ft²-°FCOLORA
Glass Transition Temp, Tg 145 °C293 °FCured property; Perkin Elmer TMS-2
Flash Point >= 125 °C>= 257 °FA Component; ASTM D92
 >= 125 °C>= 257 °FB Component; ASTM D92

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PAPTEK42 / 24204

Chemically Resistant adhesives

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