Cookson Group Plaskon® SMT-B1 Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B1 Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound designed specifically for grid arrays (BGA/LGA). It is formulated with a unique resin system, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid arrays. Features: Improved wire sweep performance Low stress Minimal warpage Outstanding high temperature flexural strength Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.86 g/cc	1.86 g/cc
Viscosity	8800 cP @Temperature 175 °C	8800 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage	0.00050 cm/cm	0.00050 in/in
Spiral Flow	77.0 cm	30.3 in	at 175°C and 1000 psi
Ash	77.4 %	77.4 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	73	73	Cull hot
Flexural Strength	103.0 MPa	14930 psi
	36.284 MPa @Temperature 215 °C	5262.6 psi @Temperature 419 °F
Flexural Modulus	13.83 GPa	2005 ksi
	8.238 GPa @Temperature 215 °C	1195 ksi @Temperature 419 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	>= 1.00e+12 ohm-cm @Temperature 150 °C	>= 1.00e+12 ohm-cm @Temperature 302 °F
	>= 1.00e+15 ohm-cm @Temperature 22.0 °C	>= 1.00e+15 ohm-cm @Temperature 71.6 °F
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	>= 15.7 kV/mm	>= 400 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F	Alpha 1
	58.0 µm/m-°C @Temperature 20.0 °C	32.2 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	225 °C	437 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	34 %	34 %

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	5.17 - 8.62 MPa	750 - 1250 psi
Cure Time	2.00 - 3.00 min	0.0333 - 0.0500 hour	In mold
	240 - 360 min @Temperature 175 °C	4.00 - 6.00 hour @Temperature 347 °F	Post mold
Gel Time	0.317 min	0.317 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.100 Month	0.100 Month	at 35°C, <40% loss of spiral flow
	0.250 Month	0.250 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK000 / 56290

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