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Chemically Resistant adhesives

Cookson Group Plaskon® SMT-B-1 LAS (146.408) Epoxy Molding Compound for PBGAs  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

An epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It is formulated with a unique resin system which minimizes warpage and enables trouble-free molding onto laminated substrates. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Excellent moldability (low viscosity); Low alpha particle count

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Physical PropertiesMetricEnglishComments
Density 1.88 g/cc0.0679 lb/in³
Viscosity 45000 cP
@Temperature 175 °C
45000 cP
@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 140 cm55.1 in175°C/1000 psi
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7575
Flexural Strength 103 MPa14900 psi
Flexural Modulus 14.0 GPa2030 ksi
 
Electrical PropertiesMetricEnglishComments
Electrical Resistivity >= 1.00e+15 ohm-cm>= 1.00e+15 ohm-cm
Dielectric Constant 3.7
@Frequency 1000 Hz
3.7
@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm406 kV/in
Dissipation Factor 0.0021
@Frequency 1000 Hz
0.0021
@Frequency 1000 Hz
 
Thermal PropertiesMetricEnglishComments
CTE, linear 16.0 µm/m-°C
@Temperature 20.0 °C
8.89 µin/in-°F
@Temperature 68.0 °F
CTE, linear, Transverse to Flow 68.0 µm/m-°C
@Temperature 20.0 °C
37.8 µin/in-°F
@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 220 °C428 °F
Flammability, UL94  V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
 
Processing PropertiesMetricEnglishComments
Processing Temperature 170 - 185 °C338 - 365 °FMolding temperature

**
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PCOOK334 / 21430

Chemically Resistant adhesives

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