Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1LV Epoxy Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. An epoxy molding compound optimized specifically for grid arrays (BGA/LGA). Using an improved optimized filler system, it provides a lower viscosity with higher flow characteristics than SMT-B-1. Minimal warpage (after post bake and solder treatment); Outstanding high temperature flexural strength; Low stress; Improved wire sweep performance (low viscosity)
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Physical Properties	Metric	English	Comments

Density	1.88 g/cc	0.0679 lb/in³
Viscosity	5000 cP @Temperature 175 °C	5000 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	130 cm	51.2 in	175°C/1000 psi

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	72	72
Flexural Strength	70.0 MPa	10200 psi
Flexural Modulus	12.5 GPa	1810 ksi

Electrical Properties	Metric	English	Comments
Electrical Resistivity	1.80e+16 ohm-cm	1.80e+16 ohm-cm
Dielectric Constant	4.0 @Frequency 1000 Hz	4.0 @Frequency 1000 Hz
Dielectric Strength	28.0 kV/mm	711 kV/in

Thermal Properties	Metric	English	Comments
CTE, linear	14.0 µm/m-°C @Temperature 20.0 °C	7.78 µin/in-°F @Temperature 68.0 °F
CTE, linear, Transverse to Flow	58.0 µm/m-°C @Temperature 20.0 °C	32.2 µin/in-°F @Temperature 68.0 °F
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	225 °C	437 °F
Flammability, UL94	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in
	V-0 @Thickness 3.20 mm	V-0 @Thickness 0.126 in

Processing Properties	Metric	English	Comments
Processing Temperature	170 - 185 °C	338 - 365 °F	Molding temperature

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PCOOK332 / 21428

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