Hexcel® HexPly® F650 Bismaleimide Resin

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Hexcel® HexPly® F650 Bismaleimide Resin
Categories:	Polymer; Thermoset; Bismaleimide (BMI)
Material Notes:	HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a cross-linked thermoset system with no condensation by-products. HexPly® F650 was developed by Hexcel to overcome existing limitations for use on complex structures and ducting in advanced military aircraft, helicopters, and many other high temperature applications. HexPly® F650 simplifies fabrications and delivers a more cost-effective end product. Advantages: Viscous, homogenous; Simple, adjustable, reaction kinetics; No resin advancement at room temperature; Simple processing and impregnation; High glass temperature relative to post cure, Dimensionally stable at greater than 500°F (260°C); High laminate mechanical strengths and strains; modest cost; Non-micro cracking for woven laminates
Key Words:	BMI
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Physical Properties	Metric	English	Comments

Specific Gravity	1.27 g/cc	1.27 g/cc
Moisture Absorption at Equilibrium	4.3 %	4.3 %

Mechanical Properties	Metric	English	Comments
Fracture Toughness	0.460 MPa-m½	0.419 ksi-in½

Thermal Properties	Metric	English	Comments
CTE, linear	49.0 µm/m-°C	27.2 µin/in-°F
Maximum Service Temperature, Air	>= 260 °C	>= 500 °F	dimensionally stable
Glass Transition Temp, Tg	>= 316 °C	>= 601 °F
Flame Spread Index	10	10	BMI/F650; ASTM E162
	15 - 20	15 - 20	Epoxy/Typical; ASTM E162
Smoke Density	<= 25	<= 25	µ g/m3; BMI/F650; ASTM E-662
	>= 300	>= 300	µ g/m3; Epoxy/Typical; ASTM E-662

Processing Properties	Metric	English	Comments
Gel Time	5.00 - 8.00 min @Temperature 177 °C	5.00 - 8.00 min @Temperature 351 °F

Descriptive Properties
Toxicity (smoke) (ppm), ASTM 662	>25		Epoxy/Typical
	5/10/2009		BMI/F650

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PHEXC001 / 98471

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