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Flame Retardant adhesives

Cookson Group Plaskon® SMT-B-2FP Molding Compound for PBGA and CSP  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 240°C IR reflow temperatures.

Features:

  • Lower moisture pickup
  • Excellent moldability
  • Low wire sweep
  • Fast cure

Information provided by Cookson Electronics

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Specific Gravity 1.88 g/cc1.88 g/cc
Moisture Absorption at Equilibrium 0.55 %0.55 %at 85°C/85% RH, 168 hours
Viscosity 2500 cP
@Temperature 175 °C
2500 cP
@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 160 cm63.0 inat 175°C and 1000 psi
Ash 78.5 %78.5 %
Storage Temperature <= 5.00 °C<= 41.0 °FRecommended
 
Mechanical PropertiesMetricEnglishComments
Hardness, Shore D 7575Cull hot
Flexural Strength 98.07 MPa14220 psi
 19.614 MPa
@Temperature 240 °C
2844.7 psi
@Temperature 464 °F
Flexural Modulus 13.73 GPa1991 ksi
 1.471 GPa
@Temperature 240 °C
213.4 ksi
@Temperature 464 °F
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity  >= 1.00e+12 ohm-cm
@Temperature 150 °C
>= 1.00e+12 ohm-cm
@Temperature 302 °F
 >= 1.00e+15 ohm-cm
@Temperature 22.0 °C
>= 1.00e+15 ohm-cm
@Temperature 71.6 °F
Dielectric Constant 4.0
@Frequency 1000 Hz
4.0
@Frequency 1000 Hz
Dielectric Strength >= 15.7 kV/mm>= 400 kV/in
 
Thermal PropertiesMetricEnglishComments
CTE, linear  18.0 µm/m-°C
@Temperature 20.0 °C
10.0 µin/in-°F
@Temperature 68.0 °F
Alpha 1
 60.0 µm/m-°C
@Temperature 20.0 °C
33.3 µin/in-°F
@Temperature 68.0 °F
Alpha 2
Thermal Conductivity 0.700 W/m-K4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 195 °C383 °F
Flammability, UL94 V-0
@Thickness 3.17 mm
V-0
@Thickness 0.125 in
 
Processing PropertiesMetricEnglishComments
Mold Temperature 170 - 185 °C338 - 365 °F
Back Pressure 5.17 - 8.62 MPa750 - 1250 psi
Cure Time 1.17 - 2.00 min0.0194 - 0.0333 hourIn mold
 0.000 - 180 min
@Temperature 175 °C
0.000 - 3.00 hour
@Temperature 347 °F
Post mold
Gel Time 0.250 min0.250 minRam follower, at 175°C and 1000 psi
Shelf Life 0.100 Month0.100 Monthat 35°C, <40% loss of spiral flow
 0.250 Month0.250 Monthat 22°C, <40% loss of spiral flow
 24.0 Month24.0 Monthat 5°C, <40% loss of spiral flow
 
Descriptive Properties
Hydrolyzable Halides<1 ppm

**
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PPLASK014 / 56304

Flame Retardant adhesives

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