| Test specimens were transfer molded and post cured 4 hours at 175°C. A low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices. It offers an alpha particle count of <0.001 counts/cm2/hour and uranium/thorium levels of 0.5 to 0.8 ppb. Excellent low stress properties; Consistent moldability (good mold filling, fast cycles and good hot hardness); Outstanding cosmetics and markability; Superior reliability |
