Glass fiber-reinforced epoxy molding compound. Good mechanical strength, very good electrical isolation properties adn dimensional stability even at high temperatures. Form: Low dust granulate packed in moisture resistant cartons, Standard carton size: 25 kg palletized in 750 kg loads. Processing: Compression/Transfer/Injection. Applications: Connectors, Thermocouples, Sensors, Resistors, Potentiometers. Information provided by the Raschig Group |