Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs

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Cookson Group Plaskon® MUF-2A LAR Molded Underfill Compound for Flip Chip BGAs and CSPs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package. Features: Higher productivity Higher glass transition temperature Higher reliability Lower warpage Lower CTE Lower cost of ownership Minimum 220°C reflow Minimum JEDEC level 3 Applications: Plaskon? MUF-2A LAR Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the combination of low wire sweep and underfill properties are essential. Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.89 g/cc	1.89 g/cc
Viscosity	4000 cP @Temperature 175 °C	4000 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Linear Mold Shrinkage	0.00050 cm/cm	0.00050 in/in
Spiral Flow	150 cm	59.1 in	at 175°C and 1000 psi
Ash	80 %	80 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85	Cull hot
Flexural Strength	83.36 MPa	12090 psi
	34.323 MPa @Temperature 215 °C	4978.2 psi @Temperature 419 °F
Flexural Modulus	17.65 GPa	2560 ksi
	5.884 GPa @Temperature 215 °C	853.4 ksi @Temperature 419 °F

Electrical Properties	Metric	English	Comments
Volume Resistivity	4.50e+15 ohm-cm	4.50e+15 ohm-cm
Dielectric Constant	3.13 @Frequency 1000 Hz	3.13 @Frequency 1000 Hz
Dielectric Strength	>= 31.5 kV/mm	>= 800 kV/in
Dissipation Factor	0.0017 @Frequency 1000 Hz	0.0017 @Frequency 1000 Hz

Thermal Properties	Metric	English	Comments
CTE, linear	16.0 µm/m-°C @Temperature 20.0 °C	8.89 µin/in-°F @Temperature 68.0 °F	Alpha 1
	55.0 µm/m-°C @Temperature 20.0 °C	30.6 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.750 W/m-K	5.20 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	195 °C	383 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	165 - 170 °C	329 - 338 °F
Back Pressure	3.45 - 6.21 MPa	500 - 900 psi
Cure Time	1.67 - 3.33 min	0.0278 - 0.0556 hour	In mold
Gel Time	0.267 min	0.267 min	Ram follower, at 175°C/1000psi
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Alpha Particle Count	<0.0015 counts/cm2/hr
Hydrolyzable Halides	<1 ppm
Preform Temperature	80-85°C
Transfer Time	6-15 seconds

**
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