| Test specimens were transfer molded and post cured 4 hours at 175°C. An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and large QFPs. It offers an alpha particle count of <0.001 counts/cm2/hour and uranium/thorium levels of 0.5 to 0.8 ppb. Ultra low stress properties; Low moisture absorption; Outstanding moldability (good mold filling, low wire sweep, fast cycles and good hot hardness); Superior reliability |
