Armstrong C-1/A Epoxy Adhesive

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Armstrong C-1/A Epoxy Adhesive
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	A versatile, low viscosity, unfilled resin used for electrical potting and laminating applications. It is an excellent insulator, and provides outstanding chemical resistance to most compounds Information provided by Ellsworth Adhesives.
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Physical Properties	Metric	English	Comments

Viscosity	2200 cP	2200 cP	Mixed

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	84	84
Tensile Strength, Ultimate	57.2 MPa	8300 psi	after optimum cure
Elongation at Break	3.5 %	3.5 %
Adhesive Bond Strength	21.0 MPa	3050 psi	Steel-Steel; after optimum cure
	11.7 MPa @Temperature -54.4 °C	1700 psi @Temperature -66.0 °F	Aluminum-Aluminum tensile shear
	14.8 MPa @Temperature 82.2 °C	2150 psi @Temperature 180 °F	Aluminum-Aluminum tensile shear
	15.2 MPa @Temperature 25.0 °C	2200 psi @Temperature 77.0 °F	Aluminum-Aluminum tensile shear

Thermal Properties	Metric	English	Comments
CTE, linear	33.0 µm/m-°C @Temperature 20.0 °C	18.3 µin/in-°F @Temperature 68.0 °F
Glass Transition Temp, Tg	89.0 °C	192 °F

Processing Properties	Metric	English	Comments
Processing Temperature	22.2 °C	72.0 °F
	73.9 °C	165 °F	Optimum cure is 2 hr. @ 165°F
Pot Life	<= 30.0 min @Temperature 25.0 °C	<= 30.0 min @Temperature 77.0 °F	100 g

Descriptive Properties
Color	Amber
Mix Ratio	100/8		By Weight

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PARM27 / 24559

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