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Ensinger PEI

Bakelite® EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound; Filled/Reinforced Thermoset

Material Notes: Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electric and mechanical properties, very good chemical resistance, low viscosity, UL listed (RTI 155°C).

Applications: Encapsulation of electric parts, e. g. electromagnetic coil

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Physical PropertiesMetricEnglishComments
Density 1.89 g/cc0.0683 lb/in³ISO 1183
Apparent Bulk Density 0.850 g/cc0.0307 lb/in³ISO 60
Linear Mold Shrinkage 0.0025 cm/cm0.0025 in/inCompression Molding. Post Shrinkage = 0.01%.; ISO 2577
 0.0030 cm/cm0.0030 in/inInjection Molding. Post Shrinkage = 0.02%.; ISO 2577
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 400 MPa58000 psiH961/30; ISO 2039/P1
Tensile Strength 55.0 MPa7980 psiISO 527 - 1/2
Tensile Modulus 13.0 GPa1890 ksiISO 527 - 1/2
Flexural Strength 125 MPa18100 psiISO 178
Flexural Modulus 15.5 GPa2250 ksiISO 178
Compressive Strength 170 MPa24700 psiISO 604
Charpy Impact Unnotched 0.850 J/cm²4.04 ft-lb/in²ISO 179-1 eU
Charpy Impact, Notched 0.400 J/cm²1.90 ft-lb/in²ISO 179-1eA
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cm
Surface Resistance 1.00e+12 ohm1.00e+12 ohm
Dielectric Constant 5.5
@Frequency 100 Hz
5.5
@Frequency 100 Hz
Dielectric Strength 30.0 kV/mm
@Thickness 1.00 mm
762 kV/in
@Thickness 0.0394 in
IEC 60243-P1
Dissipation Factor 0.020
@Frequency 100 Hz
0.020
@Frequency 100 Hz
Arc Resistance 192 - 194 sec192 - 194 secASTM D495
High Voltage Arc Resistance to Ignition (HVAR) >= 300 sec
@Thickness 1.50 mm
>= 300 sec
@Thickness 0.0591 in
BK
Comparative Tracking Index 250 V250 VIEC 6011
Hot Wire Ignition, HWI  60 - 120 sec
@Thickness 1.50 mm
60 - 120 sec
@Thickness 0.0591 in
BK
 >= 120 sec
@Thickness 3.00 mm
>= 120 sec
@Thickness 0.118 in
BK
High Amp Arc Ignition, HAI  15 - 30 arcs
@Thickness 1.50 mm
15 - 30 arcs
@Thickness 0.0591 in
BK
 60 - 120 arcs
@Thickness 3.00 mm
60 - 120 arcs
@Thickness 0.118 in
BK
High Voltage Arc-Tracking Rate, HVTR 0.000 - 10.0 mm/min
@Thickness 3.00 mm
0.000 - 0.394 in/min
@Thickness 0.118 in
BK
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 180 °C356 °F<20000 hours; IEC 60216-P1
 220 °C428 °F< 50 hours; IEC 60216-P1
Deflection Temperature at 8.0 MPa 120 °C248 °FISO 75-2
UL RTI, Electrical 155 °C
@Thickness 1.50 mm
311 °F
@Thickness 0.0591 in
BK
UL RTI, Mechanical with Impact 155 °C
@Thickness 1.50 mm
311 °F
@Thickness 0.0591 in
BK
UL RTI, Mechanical without Impact 155 °C
@Thickness 1.50 mm
311 °F
@Thickness 0.0591 in
BK
Flammability, UL94 HB
@Thickness 1.50 mm
HB
@Thickness 0.0591 in
BK
 
Processing PropertiesMetricEnglishComments
Feed Temperature 60.0 - 75.0 °C140 - 167 °FInjection molding
Nozzle Temperature 70.0 - 100 °C158 - 212 °FInjection molding
Melt Temperature 90.0 - 100 °C194 - 212 °FInjection molding
Mold Temperature 160 - 190 °C320 - 374 °FCompression molding
 170 - 190 °C338 - 374 °FInjection molding
Injection Pressure >= 10.0 MPa>= 1450 psiCompression and injection cavity mold pressure
Back Pressure 0.500 - 2.00 MPa72.5 - 290 psiInjection molding
Cure Time 0.250 - 0.417 min0.00417 - 0.00694 hourPer 1 mm of wall thickness, injection molding
 0.500 - 1.00 min0.00833 - 0.0167 hourPer 1 mm of wall thickness, compression molding
 
Descriptive Properties
Chromatic SpectrumSubdued Colors
Creep Rupture StrengthVery Good
Holding PressureApproximately 40-60% of injection pressure
Media ResistanceVery Good
Thermal ExpansionVery Slight
Water absorption (mg)624h / 23°C

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