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Ensinger PEI

Solvay CYCOM® 5250-4 BMI Prepreg System with G30-500-3K-70PW Woven Carbon Fiber
Categories: Polymer; Thermoset; Bismaleimide (BMI); Carbon Fiber/Thermoset Composite

Material Notes: 58 Volume % G30-500-3K-70PW.

CYCOM® 5250-4 is a 350°F to 400°F (177°C to 204°C) curing bismaleimide resin with a service temperature range of -75°F to 400°F (-59°C to 204°C). CYCOM 5250-4 is specifically formulated for use in primary aircraft structures. In addition, a variety of secondary structural components can take advantage of the increased performance from using high-strain carbon fibers and the improved damage-resistance this system provides. CYCOM 5250-4 is available with either carbon fiber or glass fiber reinforcement in unidirectional tape, woven broadgood and roving forms.

Features & Benefits:

  • Short-term service temperature up to 450°F (232°C)
  • Superior hot/wet properties at 220°F to 375°F (104°C to 190°C)
  • Excellent toughness
  • Void-free laminates
  • High temperature resistance
  • Low thermal conductivity
  • Versatile cure
  • Excellent compression strength properties after impact
  • Shop life greater than 28 days at room temperature
  • Fluid/solvent resistant
Suggested Applications: Primary and secondary aircraft structure including:
  • Engine nacelles
  • Fuselage skins and stiffeners
  • Wing and stabilizer spars and skins
  • Other critical load-bearing components
Mechanical properties are reported for standard cure + standard post-cure

Information provided by Cytec, subsequently acquired by Solvay.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.25 g/cc0.0452 lb/in³Neat Resin; QC-PT-55
Volatiles 2.0 %2.0 %
Water Absorption 1.3 %
@Temperature 149 °C
1.3 %
@Temperature 300 °F
As Tested (Wet)
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 931 MPa
@Temperature 24.0 °C
135000 psi
@Temperature 75.2 °F
Warp (0°), G30-500-3K-70PW; ASTM D3039
Tensile Modulus 69.0 GPa
@Temperature 24.0 °C
10000 ksi
@Temperature 75.2 °F
Warp (0°), G30-500-3K-70PW
Compressive Strength  179 MPa
@Temperature 177 °C
26000 psi
@Temperature 351 °F
Open Hole, [(+/-45),(0/90)], G30-500-3K-70PW
 230 MPa
@Temperature 149 °C
33400 psi
@Temperature 300 °F
Open Hole, [(+/-45),(0/90)], G30-500-3K-70PW, wet
 262 MPa
@Temperature 121 °C
38000 psi
@Temperature 250 °F
Open Hole, [(+/-45),(0/90)], G30-500-3K-70PW
 302 MPa
@Temperature 24.0 °C
43800 psi
@Temperature 75.2 °F
Open Hole, [(+/-45),(0/90)], G30-500-3K-70PW
 414 MPa
@Temperature 163 °C
60000 psi
@Temperature 325 °F
Warp (0°), G30-500-3K-70PW, Wet
 827 MPa
@Temperature 163 °C
120000 psi
@Temperature 325 °F
Warp (0°), G30-500-3K-70PW
 932 MPa
@Temperature 24.0 °C
135000 psi
@Temperature 75.2 °F
Warp (0°), G30-500-3K-70PW
Compressive Modulus 61.0 GPa8850 ksiWarp (0°), G300-500-3K-70PW
Shear Strength  34.5 MPa
@Temperature 163 °C
5000 psi
@Temperature 325 °F
Compression Interlaminar Warp (0°), G30-500-3K-70PW, Wet
 34.5 MPa
@Temperature 177 °C
5000 psi
@Temperature 351 °F
Short Beam Warp, G30-500-3K-70PW, wet
 44.1 MPa
@Temperature 177 °C
6400 psi
@Temperature 351 °F
Short Beam Warp, G30-500-3K-70PW
 55.8 MPa
@Temperature 121 °C
8100 psi
@Temperature 250 °F
Short Beam Warp, G30-500-3K-70PW
 62.1 MPa
@Temperature 24.0 °C
9000 psi
@Temperature 75.2 °F
Compression Interlaminar Warp (0°), G30-500-3K-70PW
 63.4 MPa
@Temperature 24.0 °C
9200 psi
@Temperature 75.2 °F
Short Beam Warp, G30-500-3K-70PW
 
Thermal PropertiesMetricEnglishComments
Maximum Service Temperature, Air 204 °C400 °FContinuous; depends on cure cycle
 232 °C450 °Fshort term; depends on cure cycle
Minimum Service Temperature, Air -59.4 °C-75.0 °F
Glass Transition Temp, Tg 200 °C392 °FWet; QC-PT-22
 216 °C421 °FPost Cure: 177°C for 6 hrs
 249 °C480 °FPost Cure: 190°C for 6 hrs
 263 °C505 °FPost Cure: 210°C for 6 hrs
 282 °C540 °FPost Cure: 227°C for 6 hrs
 300 °C572 °FDry; QC-PT-22
 304 °C579 °FPost Cure: 243°C for 6 hrs
 
Processing PropertiesMetricEnglishComments
Processing Temperature 177 - 204 °C350 - 400 °FCure Temperature - Autoclave
Gel Time 65.0 min
@Temperature 177 °C
65.0 min
@Temperature 351 °F
in nitrogen atmosphere; QC-TP-87
Shelf Life  >= 1.00 Month
@Temperature 72.0 °C
>= 1.00 Month
@Temperature 162 °F
 >= 3.00 Month
@Temperature 4.44 °C
>= 3.00 Month
@Temperature 40.0 °F
 >= 12.0 Month
@Temperature -17.8 °C
>= 12.0 Month
@Temperature 0.000 °F

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PCYTED133_5 / 192681

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