Cookson Group Plaskon® S-7PG Low Stress Epoxy Encapsulant

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Cookson Group Plaskon® S-7PG Low Stress Epoxy Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is a low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. It offers end users superior value-in-use due to a balanced mix of properties. Features: Consistent moldability Outstanding cosmetics and markability Excellent low stress properties Superior reliability Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.84 g/cc	1.84 g/cc
Viscosity	900 cP @Temperature 175 °C	900 cP @Temperature 347 °F	Automatic orifice Viscosity
Linear Mold Shrinkage	0.0047 cm/cm	0.0047 in/in
Spiral Flow	60.0 - 90.0 cm	23.6 - 35.4 in	at 177°C and 1000 psi
Ash	73.7 %	73.7 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	70	70	Cull hot, 90 sec @ 175°C
Tensile Strength at Break	63.74 MPa	9245 psi
Flexural Strength	106.9 MPa	15500 psi
Flexural Modulus	13.10 GPa	1900 ksi

Electrical Properties	Metric	English	Comments
Volume Resistivity	5.50e+15 ohm-cm	5.50e+15 ohm-cm
Dielectric Constant	3.6 @Frequency 1000 Hz	3.6 @Frequency 1000 Hz
Dielectric Strength	15.7 kV/mm	400 kV/in
Dissipation Factor	0.0040 @Frequency 1000 Hz	0.0040 @Frequency 1000 Hz
Arc Resistance	180 sec	180 sec	110V AC

Thermal Properties	Metric	English	Comments
CTE, linear	18.0 µm/m-°C @Temperature 20.0 °C	10.0 µin/in-°F @Temperature 68.0 °F	Alpha 1
	65.0 µm/m-°C @Temperature 20.0 °C	36.1 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.670 W/m-K	4.65 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	170 °C	338 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in
Oxygen Index	32 %	32 %

Processing Properties	Metric	English	Comments
Mold Temperature	170 - 185 °C	338 - 365 °F
Back Pressure	6.21 - 8.27 MPa	900 - 1200 psi
Cure Time	1.00 - 2.00 min @Temperature 177 °C	0.0167 - 0.0333 hour @Temperature 351 °F
	240 - 720 min @Temperature 175 °C	4.00 - 12.0 hour @Temperature 347 °F	Post mold
Gel Time	0.167 - 0.300 min	0.167 - 0.300 min	Ram follower, at 177°C
Shelf Life	0.0670 Month	0.0670 Month	at 35°C, <40% loss of spiral flow
	0.167 Month	0.167 Month	at 21°C, <40% loss of spiral flow
	24.0 Month	24.0 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Cl	<1 ppm
Preheat Temperature	85-95°C

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK022 / 56312

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