Cookson Group Plaskon® NXG-1FP Molding Compound for Fine Pitch Applications

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Cookson Group Plaskon® NXG-1FP Molding Compound for Fine Pitch Applications (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound for high temperature, lead-free reflow in fine pitch applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a “green” compound with no halogens and a lower Tg than multifunctional materials. Features: Very low moisture pickup No halogens "green" Good moldability Fast cure Information provided by Cookson Electronics
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Physical Properties	Metric	English	Comments

Specific Gravity	1.97 g/cc	1.97 g/cc
Moisture Absorption at Equilibrium	0.30 %	0.30 %	at 85°C/85% RH, 168 hours
Viscosity	4000 cP @Temperature 175 °C	4000 cP @Temperature 347 °F	Shimadzu Viscosity, 1000 psi
Spiral Flow	180 cm	70.9 in	at 175°C and 1000 psi
Ash	87 %	87 %
Storage Temperature	<= 5.00 °C	<= 41.0 °F	Recommended

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	75	75	Cull hot
Flexural Strength	125.5 MPa	18210 psi
	8.6302 MPa @Temperature 260 °C	1251.7 psi @Temperature 500 °F
Flexural Modulus	22.56 GPa	3271 ksi
	0.6865 GPa @Temperature 260 °C	99.56 ksi @Temperature 500 °F

Thermal Properties	Metric	English	Comments
CTE, linear	11.5 µm/m-°C @Temperature 20.0 °C	6.39 µin/in-°F @Temperature 68.0 °F	Alpha 1
	42.0 µm/m-°C @Temperature 20.0 °C	23.3 µin/in-°F @Temperature 68.0 °F	Alpha 2
Thermal Conductivity	0.700 W/m-K	4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg	150 °C	302 °F
Flammability, UL94	V-0 @Thickness 3.17 mm	V-0 @Thickness 0.125 in

Processing Properties	Metric	English	Comments
Mold Temperature	165 - 185 °C	329 - 365 °F
Back Pressure	6.89 MPa	1000 psi
Cure Time	0.833 - 1.67 min	0.0139 - 0.0278 hour	In mold
	0.000 - 120 min @Temperature 175 °C	0.000 - 2.00 hour @Temperature 347 °F	Post mold
Gel Time	0.300 min	0.300 min	Ram follower, at 175°C and 1000 psi
Shelf Life	0.0167 Month	0.0167 Month	at 35°C, <40% loss of spiral flow
	0.0670 Month	0.0670 Month	at 22°C, <40% loss of spiral flow
	6.00 Month	6.00 Month	at 5°C, <40% loss of spiral flow

Descriptive Properties
Hydrolyzable Halides	<1 ppm

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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PPLASK016 / 56306

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