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Ensinger SPI

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SABIC LNP™ THERMOCOMP™ Compound 9X99089 Polyetherimide (PEI)
Categories: Polymer; Thermoplastic; Polyetherimide (PEI)

Material Notes: LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Features: Light-weight Structural,Super Strong (Carbon Fiber Filled),Electrically Conductive,Structural

Information provided by SABIC

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Physical PropertiesOriginal ValueComments
Density 1.34 g/ccISO 1183
Moisture Absorption 0.0200 %Injection Molding
Linear Mold Shrinkage, Flow 0.0040 cm/cmSABIC method
 
Mechanical PropertiesOriginal ValueComments
Tensile Strength at Break 185 MPa5 mm/min; ISO 527
Elongation at Break 1.7 %5 mm/min; ISO 527
Tensile Modulus 11100 MPa1 mm/min; ISO 527
Flexural Strength 214 MPayield, 2 mm/min; ISO 178
Flexural Modulus 10900 MPa2 mm/min; ISO 178
Izod Impact, Notched (ISO) 6.00 kJ/m²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 40.0 kJ/m²80*10*4; ISO 180/1U
 
Thermal PropertiesOriginal ValueComments
Deflection Temperature at 1.8 MPa (264 psi) 213 °CFlatw 80*10*4 sp=64mm; ISO 75/Af
 
Processing PropertiesOriginal ValueComments
Zone 2 355 - 365 °C
Zone 3 365 - 375 °C
Melt Temperature 360 - 365 °CInjection Molding
Mold Temperature 120 - 150 °C
Drying Temperature 120 - 150 °CInjection Molding
Dry Time 4.00 - 6.00 hourInjection Molding
Back Pressure 0.300 - 0.700 MPa
Screw Speed 60 - 100 rpm

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PSABH81451 / 289398

Ensinger SPI

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