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Ensinger SPI

SABIC LNP™ THERMOCOMP™ Compound 9X99089 Polyetherimide (PEI)
Categories: Polymer; Thermoplastic; Polyetherimide (PEI)

Material Notes: LNP THERMOCOMP 9X99089 compound is based on Polyetherimide (PEI) resin containing 20% carbon fiber. Added features of this grade include: Electrically Conductive.

Features: Light-weight Structural,Super Strong (Carbon Fiber Filled),Electrically Conductive,Structural

Information provided by SABIC

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Physical PropertiesMetricEnglishComments
Density 1.34 g/cc0.0484 lb/in³ISO 1183
Moisture Absorption 0.0200 %0.0200 %Injection Molding
Linear Mold Shrinkage, Flow 0.0040 cm/cm0.0040 in/inSABIC method
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength at Break 185 MPa26800 psi5 mm/min; ISO 527
Elongation at Break 1.7 %1.7 %5 mm/min; ISO 527
Tensile Modulus 11.1 GPa1610 ksi1 mm/min; ISO 527
Flexural Strength 214 MPa31000 psiyield, 2 mm/min; ISO 178
Flexural Modulus 10.9 GPa1580 ksi2 mm/min; ISO 178
Izod Impact, Notched (ISO) 6.00 kJ/m²2.86 ft-lb/in²80*10*4; ISO 180/1A
Izod Impact, Unnotched (ISO) 40.0 kJ/m²19.0 ft-lb/in²80*10*4; ISO 180/1U
 
Thermal PropertiesMetricEnglishComments
Deflection Temperature at 1.8 MPa (264 psi) 213 °C415 °FFlatw 80*10*4 sp=64mm; ISO 75/Af
 
Processing PropertiesMetricEnglishComments
Zone 2 355 - 365 °C671 - 689 °F
Zone 3 365 - 375 °C689 - 707 °F
Melt Temperature 360 - 365 °C680 - 689 °FInjection Molding
Mold Temperature 120 - 150 °C248 - 302 °F
Drying Temperature 120 - 150 °C248 - 302 °FInjection Molding
Dry Time 4.00 - 6.00 hour4.00 - 6.00 hourInjection Molding
Back Pressure 0.300 - 0.700 MPa43.5 - 102 psi
Screw Speed 60 - 100 rpm60 - 100 rpm

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PSABH81451 / 289398

Ensinger SPI

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