BASF Ultraform® H 4320 PRO POM

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USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

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BASF Ultraform® H 4320 PRO POM
Categories:	Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM)
Material Notes:	Ultraform H 4320 PRO is an unfilled injection molding POM grade, which supports customers in product development for the medical technology market. This grade complied with US Pharmacopoeia: Biological Reactivity Tests, USP Plastic Class VI (USP VI), ISO 10993-5: Biological Evaluation of Medical Devices Part 5: Test for Cytotoxicity, DMF: A Drug Master File (DMF) has been registered at FDA for Ultraform® PRO and Food Contact: Ultraform® PRO is in compliance with multiple regional food contact regulations, especially for Europe and United States. Applications: This material can be used for functional parts in devices such as insulin pens or powder inhalers as well as for plug in connectors or medical device handles. Information provided by BASF.
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Physical Properties	Original Value	Comments

Density	1.39 g/cc	ISO 1183
Moisture Absorption	0.200 %	50% RH; ISO 62
Water Absorption at Saturation	0.80 %	ISO 62
Melt Flow	2.2 g/10 min	ISO 1133

Mechanical Properties	Original Value	Comments
Ball Indentation Hardness	125 MPa	ISO 2039-1
Tensile Strength, Yield	63.0 MPa	ISO 527
Elongation at Yield	10 %	ISO 527
Tensile Modulus	2600 MPa	ISO 527
Charpy Impact Unnotched	180 kJ/m² @Temperature -30.0 °C	ISO 179
	250 kJ/m² @Temperature 23.0 °C	ISO 179
Charpy Impact, Notched	5.50 kJ/m² @Temperature -30.0 °C	ISO 179
	6.00 kJ/m² @Temperature 23.0 °C	ISO 179
Tensile Creep Modulus, 1000 hours	1300 MPa	ISO 899

Electrical Properties	Original Value	Comments
Volume Resistivity	1.00e+13 ohm-cm	IEC 60093
Surface Resistance	1.00e+13 ohm	IEC 60093
Dielectric Constant	3.8 @Frequency 1e+6 Hz	IEC 60250
Dissipation Factor	0.0050 @Frequency 1e+6 Hz	IEC 60250
Comparative Tracking Index	600 V	IEC 60112

Thermal Properties	Original Value	Comments
CTE, linear, Parallel to Flow	120 µm/m-°C
Melting Point	166 °C	ISO 3146
Deflection Temperature at 1.8 MPa (264 psi)	95.0 °C	ISO 75

Processing Properties	Original Value	Comments
Melt Temperature	190 - 230 °C
Mold Temperature	45.0 - 105 °C	can be used where applicable
	80.0 - 90.0 °C	recommended
	60.0 - 120 °C
Drying Temperature	80.0 - 100 °C @Time 7200 - 14400 sec
Moisture Content	<= 0.15 %
Injection Pressure	500 - 1000 psi

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PBASF8919 / 254877

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