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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

BASF Ultraform® H 4320 PRO POM
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM)

Material Notes: Ultraform H 4320 PRO is an unfilled injection molding POM grade, which supports customers in product development for the medical technology market. This grade complied with US Pharmacopoeia: Biological Reactivity Tests, USP Plastic Class VI (USP VI), ISO 10993-5: Biological Evaluation of Medical Devices Part 5: Test for Cytotoxicity, DMF: A Drug Master File (DMF) has been registered at FDA for Ultraform® PRO and Food Contact: Ultraform® PRO is in compliance with multiple regional food contact regulations, especially for Europe and United States.

Applications: This material can be used for functional parts in devices such as insulin pens or powder inhalers as well as for plug in connectors or medical device handles.

Information provided by BASF.

Vendors: No vendors are listed for this material. Please click here if you are a supplier and would like information on how to add your listing to this material.
 
Physical PropertiesMetricEnglishComments
Density 1.39 g/cc0.0502 lb/in³ISO 1183
Moisture Absorption 0.200 %0.200 %50% RH; ISO 62
Water Absorption at Saturation 0.80 %0.80 %ISO 62
Melt Flow 2.2 g/10 min2.2 g/10 minISO 1133
 
Mechanical PropertiesMetricEnglishComments
Ball Indentation Hardness 125 MPa18100 psiISO 2039-1
Tensile Strength, Yield 63.0 MPa9140 psiISO 527
Elongation at Yield 10 %10 %ISO 527
Tensile Modulus 2.60 GPa377 ksiISO 527
Charpy Impact Unnotched  18.0 J/cm²
@Temperature -30.0 °C
85.7 ft-lb/in²
@Temperature -22.0 °F
ISO 179
 25.0 J/cm²
@Temperature 23.0 °C
119 ft-lb/in²
@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched  0.550 J/cm²
@Temperature -30.0 °C
2.62 ft-lb/in²
@Temperature -22.0 °F
ISO 179
 0.600 J/cm²
@Temperature 23.0 °C
2.86 ft-lb/in²
@Temperature 73.4 °F
ISO 179
Tensile Creep Modulus, 1000 hours 1300 MPa189000 psiISO 899
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+13 ohm-cm1.00e+13 ohm-cmIEC 60093
Surface Resistance 1.00e+13 ohm1.00e+13 ohmIEC 60093
Dielectric Constant 3.8
@Frequency 1e+6 Hz
3.8
@Frequency 1e+6 Hz
IEC 60250
Dissipation Factor 0.0050
@Frequency 1e+6 Hz
0.0050
@Frequency 1e+6 Hz
IEC 60250
Comparative Tracking Index 600 V600 VIEC 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 120 µm/m-°C66.7 µin/in-°F
Melting Point 166 °C331 °FISO 3146
Deflection Temperature at 1.8 MPa (264 psi) 95.0 °C203 °FISO 75
 
Processing PropertiesMetricEnglishComments
Melt Temperature 190 - 230 °C374 - 446 °F
Mold Temperature 45.0 - 105 °C113 - 221 °Fcan be used where applicable
 80.0 - 90.0 °C176 - 194 °Frecommended
 60.0 - 120 °C140 - 248 °F
Drying Temperature 80.0 - 100 °C
@Time 7200 - 14400 sec
176 - 212 °F
@Time 2.00 - 4.00 hour
Moisture Content <= 0.15 %<= 0.15 %
Injection Pressure 3.45 - 6.89 MPa500 - 1000 psi

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PBASF8919 / 254877

USP Class VI adhesives

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