Homide 250 is a prepolymer bismaleimide resin system with a low softening range of 90-125°C supplied in powder form. The resin can be cured thermally to create a cross-linked thermoset with excellent thermal and mechanical resistance. Homide 250 can be processed in powder form or dissolved in an organic solvent, such as dimethylformamide or N-methylpyrrolidone, up to a concentration of 45% for the production of composite materials. |