Redux® HP655 is a toughened BMI structural adhesive designed for metal to metal, composite to composite, and honeycomb sandwich bonding for both co-cured and precured composite skins. Redux® HP655 combines high fracture toughness and high shear with good peel strengths. Recommended service temperature is up to 350°F wet and 460°F dry. Redux® HP655 was developed to be compatible with Hexcel's entire BMI prepreg product line.Features: Good co-cure potential with Hexcel's BMI prepreg range; Excellent hot lap shear performance; Good fracture toughness; Low volatile content and low out-gassing properties; Available with or without a woven glass carrier. Applications: Metal to metal bonding; Composite to composite bonding; Sandwich constructions. |