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Metal adhesives
Master Bond EP21NS Two part, moderate viscosity, nanosilica filled epoxy for bonding, sealing, coating and encapsulation
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Master Bond EP21NS is a nanosilica filled epoxy system with a one to one mix ratio by weight. Upon mixing, it has moderate viscosity and good flow properties. It is formulated to cure at room temperature or more rapidly at elevated temperatures. The optimum cure is overnight at room temperature, followed by 4-5 hours at 150°F. This system is 100% reactive and does not contain any solvents or diluents. Because of the nanosilica filling it has exceptionally low shrinkage upon curing. EP21NS bonds well to a wide variety of materials including metals, composites, glass, ceramics, rubbers and many plastics. It has excellent physical strength properties. EP21NS is highly resistant to water, oils, fuels, and salts. Using nanosilica resin gives this system enhanced dimensional stability and additional abrasion resistance. The electrical insulation profile is especially interesting, with a notable dielectric constant. The service temperature range is -80°F to +250°F. Part A is translucent, Part B is amber. This system is recommended for use in the aerospace, electronic, optical, opto-electronic and specialty OEM applications where the property enhancements attributed to the nanosilica filler are essential.

Product Advantages:

  • Convenient one to one mix ratio by weight
  • Long working life
  • Moderately high viscosity, flowable
  • Noteworthy abrasion resistance
  • Exceptional electrical properties at 16 GHz
Key Features:
  • Convenient mix ratio
  • Exceptionally low shrinkage upon curing
  • Outstanding dimensional stability
  • Extraordinary electrical insulation properties

Information provided by Master Bond.

Vendors:
Available Properties
  • Viscosity, Part B
  • Viscosity, Mixed viscosity
  • Viscosity, Part A
  • Hardness, Shore D
  • Tensile Strength
  • Tensile Modulus
  • Compressive Strength
  • Adhesive Bond Strength, Tensile lap shear, Al to Al
  • Taber Abrasion, mg/1000 Cycles, CS-17 wheel
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Dissipation Factor
  • CTE, linear
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, Optimal: overnight at 75°F plus 4-5 hours at 150°F
  • Cure Time, Option 2
  • Cure Time, Option 1
  • Working Life, 100 gram batch
  • Shelf Life
  
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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Metal adhesives
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