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Master Bond adhesives
Cookson Group STAYCHIP® 3080 High Reliability Flip Chip Underfill, Fast Flow and Cure  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy

Material Notes: STAYCHIP 3080 is a high reliability capillary underfill designed for high performance adhesion to common mask, solder, and die passivation surfaces, even after exposure to elevated heat, pressure, and humidity. This material provides superior adhesion even after pressure cooker environmental conditioning. This fast flow underfill was formulated for penetration of gaps below 1mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and also exhibits low moisture absorption for improved JEDEC performance.

Features:

  • Excellent reliability in thermal cycling
  • Excellent Reliability in JEDEC testing (L3 260°C on select laminate based FCIP)
  • Low Moisture Absorption
  • Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
  • Fast, Efficient Flow Properties

Information provided by Cookson Electronics

Vendors:
Available Properties
  • Specific Gravity, ASTM D 1475-60
  • Filler Content
  • Moisture Absorption at Equilibrium, 2 hour boil
  • Particle Size
  • Brookfield Viscosity, Brookfield #51 at 10 RPM
  • Storage Temperature
  • Hardness, Shore D, ASTM D 2240
  • Flexural Modulus, ASTM D 790
  • Fracture Toughness
  • Adhesive Bond Strength, Shear strength to Si3N4 passivated Silicon Die, 75 micron gap, 5x5 mm
  • Dielectric Constant
  • Dissipation Factor
  • Dissipation Factor
  • Dissipation Factor
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Glass Transition Temp, Tg, By DSC
  • Flash Point, ASTM D 93-85
  • Pot Life, Time to double viscosity
  • Shelf Life
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
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