| LORD CoolTherm™ SG-21 thermally conductive grease is a non-reactive, silicone material designed for applications where the heat sink may later need to be easily removed from the device. CoolTherm SG-21 grease can be used with a variety of devices including flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and high-speed memory devices. The thixotropic character of CoolTherm SG-21 grease will hold the heat sink in place until it is mechanically attached. Features: provides thermal conductivity for applications where superior heat dissipation is required, achieves thin bondlines of =1 mil, minimizing the thermal pathway and maximizing heat flow. easily removed with isopropyl alcohol or acetone, eliminating the use of toxic solvents. provides minimal thermal resistance due to low viscosity and good wetting. provides excellent resistance to moisture and temperature cycling; low bleed. All information provided by Lord. |
