STAYCHIP™ 3082 is a highly filled, high reliability capillary underfill designed for high performance applications. This material provides superior adhesion to common solder-mask and die passivations, even after exposure to elevated heat, pressure, and humidity for superior JEDEC performance. This fast flow underfill was formulated for penetration of gaps below 1 mil. When fully cured, the material displays excellent reliability in thermal cycling performance. It is easily dispensed and exhibits low moisture absorption for improved JEDEC performance. Features: - Excellent reliability in thermal cycling
- Excellent Reliability in JEDEC testing
- Low CTE
- High Tg
- Exceptional adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, efficient flow properties
- Small particle size filler for use on fine pitch array packages
- High filler loading while maintaining fast flow properties
Information provided by Cookson Electronics |