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Master Bond adhesives
Lord Adhesives Thermoset™ ME-541 Underfill Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-541 encapsulant is an anhydride free, high purity, semi-conductor grade epoxy underfill product developed for the encapsulation of densely populated area array flip chip devices. It is formulated with the necessary structural strength to handle overmolding processes.

Thermoset ME-541 encapsulant is engineered to withstand 260°C peak reflow temperatures of lead-free solders.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity
  • Water Absorption
  • Viscosity, TA Rheometer
  • Modulus of Elasticity, Storage
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Glass Transition Temp, Tg, TMA
  • Cure Time
  • Cure Time
  • Pot Life
  • Gel Time
  • Shelf Life
  • Potassium, K
  • Sodium, Na
  
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Category Notes
Plastic

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